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    Douglas R. Hackler, Sr.

    President & CEO
    American Semiconductor
    Boise, ID, United States

    Mr. Hackler is President & CEO of American Semiconductor and the co-inventor of Semiconductor-on-Polymer™ packaging technology. He has more than 30 years of experience in wafer fabrication, packaging, assembly and test processing, manufacturing and commercialization at American Semiconductor, M/A-Com, Zilog, Intel, NorTel and General Instrument. Doug has multiple patents for solid state technology and packaging and has published numerous technical papers. Doug holds engineering degrees from the University of Idaho (MSEE), Boise State University (BSEE) and in management from Texas Tech University (BBA).

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