This presentation provides a summary of progress for FlexTech Project Number AF61-23-219
Abstract: Measuring electrical signal performance during physical-based failure analysis is critical to characterizing FHE systems, but is exceedingly rare. Physics-based failure analysis (e.g., root cause analysis of the failure mode and mechanism) requires understanding the degree of mechanical, electrical, and environmental stress at the time of failure and the failure trait first exhibited. This includes the understanding of these variables accumulating over time. This project seeks to identify root-causes of FHE material and system failures utilizing a new harsh environment test capability for in situ mechanical and electrical data generation. Root cause determination is enabled with the understanding of the mechanical, electrical and environmental stress conditions as they are reflected in physical and electrical properties. The work reflects a collaborative effort of American Semiconductor and Bayflex Solutions to provide new test services capability and test systems for FHE reliability characterization.