Vice President, Corporate R&D
ASE Group
Kaohsiung, Taiwan (Republic of China)
Dr. C.P. Hung currently holds the position of Vice President, Corporate R&D, at ASE Group. Based in Taiwan, he leads teams responsible for next-generation product development featuring integrated technologies, as well as a broad range of advanced chip, package, and system integration solutions with multiple ASE and USI Sites.
During his tenure, Dr. Hung has performed a variety of management roles at ASE, including VP of Corporate Design, VP of Central Engineering & Business Development and VP of Logistic Services Integration. He holds 187 patents encompassing IC packaging structure, process, substrate and characterization technology. He has also published over 109 conference and journal papers.
Dr. Hung has being the SEMICON Taiwan PKG & TEST Committee Chair since 2013, and currently Co-Chair since 2021. He is also a board of governor of IEEE EPS since 2019.
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Advanced Packaging for Sustainable Additive Manufacturing Innovations
Wednesday, July 10, 2024
11:30am – 12:15pm PDT
FLEX Panel Discussion: Enabling the Future of Electronics
Wednesday, July 10, 2024
5:30pm – 6:30pm PDT