Thermal interface materials (TIMs) are increasingly becoming an efficiency bottleneck for advanced semiconductors. In datacenters, 4% to 20% of overall energy consumption is due to thermal interface losses. Boston Materials is addressing this issue with advanced TIMs that deliver a 5x reduction in these losses. The company uses a patented technology to vertically align reclaimed carbon fibers, resulting in materials with very high thermal conductivity and low interface resistance. Boston Materials' TIM product line includes a liquid metal-based solution optimized for applications where very low thermal resistance and high reliability are critical. These benefits can unlock significant efficiency improvements in datacenter cooling systems, enhancing the efficiency and effectiveness of both conventional air-cooled systems and emerging liquid-cooled systems.