Compute energy-delay performance is today communication limited. The scaling vectors of cost, bandwidth density and energy are challenged by the physical limits of electronic interconnect bandwidth. The emergence of foundry compatible silicon photonics solutions promises to relieve this roadblock with electronic-photonic integration at the package level. These solutions, as described in the recent release of the 2023 Integrated Photonics System Roadmap – International, will be review with a focus on materials, tools, processes and system sustainability for performance scaling at the package level.