Vice President Intel Hillsboro, Oregon, United States
Over the last 25 years, the progress that our industry has made through material introductions enabling continued scaling has yielded ever-increasing improvements in computing power, performance, and cost through Moore’s Law benefits.
As we enter the Angstrom era, despite the significant challenges of continued progress, maintaining this trajectory has never been more important, given the ever-increasing environmental impact of compute and AI workloads.
This talk will highlight both the paths ahead to continue to squeeze additional benefits from Si CMOS and point to the path beyond where we look for new materials and devices so that we can continue delivering Moore’s Law benefits.