SEMI U
Paul Hoffman
President
Sapient Focus
This 1-day course addresses IC packaging, assembly, and package/substrate interconnections. It stresses the impact of the IC and end product requirements, i.e., “smaller, better, cheaper” their influence on the manufacturing processes. Topics include area packaging - ball grid arrays, flip chip, fanout, stacking die and chip scale packages, and the assembly technologies – Chip & Wire, Tape Automated Bonding, and Flip Chip, as is emerging technologies namely, 3-D and stacked die, and packaging reliability issues. This course is suitable for anyone seeking a better understanding of the assembly and packaging of semiconductor devices.