Student; Ph.D. Candidate
UCLA Center for Heterogeneous Integration and Performance Scaling
Reseda, California, United States
Randall Irwin received the B.S. degree in electrical engineering from the University of California, Los Angeles (UCLA) in 2019. He is currently a Ph.D. candidate in the UCLA Center for Heterogeneous Integration and Performance Scaling (CHIPS) in the department of electrical and computer engineering. He has been a Student Researcher at UCLA CHIPS since 2017 where he has researched flexible electronic packaging, enabling technologies for systems-on-wafer, thermally conductive elastomers, and heterogeneous integration.
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