Director of Solutions Engineering
Tignis
Seattle, WA, United States
Boyd Finlay is Director of Solutions Engineering at Tignis, a differentiated AI based Process Monitoring and Controls company. He is a past recipient of the prestigious Scottish Engineering 'Young Scottish Engineer of the Year' award and has held engineering, operations and technical leadership positions at National Semiconductor, SEMATECH, and Globalfoundries. Boyd holds a BSc(hons) Instrumentation with Applied Physics from Glasgow Caledonian University, an MBA from Robert Gordon University, and is a US patent holder with 5 patents all in the field of semiconductor process and equipment control.
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Transforming Legacy Fab Equipment Maintenance with AI/ML Integration
Wednesday, July 10, 2024
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