Capacitor and Inductor Embedded/Integrated Package Solution(iPaS) for Next Generation High Performance Computing (HPC) Applications

iPaS (integrated Passive Substrate) is an embedded capacitor product. It utilizes Murata's capacitor design and competitive manufacturing technologies. iPaS is applied to both circuit board in power supply module and semiconductor package. It reduces the power delivery network impedance in a wide frequency range, which could contribute to next generation packaging technologies like vertical power delivery. iPaS is an important key to lower power consumption in high-performance computing.