FLEXTalks

Session Moderator (FLEX)(s)

• LT

  Lin Tso

  Sr. Program Manager
  SEMI Americas

Presentations:

• 2:00pm – 2:05pm PDT

  Welcome to FLEXTalks
  

  Speaker (FLEXTalks): Lin Tso – SEMI Americas
• 2:05pm – 2:20pm PDT

  Flex, Rigidflex, Design, Manufacturing and In-house Assembly
  

  Speaker (FLEXTalks): Mike Morando – PFC Flexible Circuits
• 2:20pm – 2:35pm PDT

  BioMEMS and FLEX Electronics: Medical FLEX Applications and a Foundry to Serve Them
  

  Speaker (FLEXTalks): Mark Hettick – Precision
• 2:35pm – 2:50pm PDT

  Capacitor and Inductor Embedded/Integrated Package Solution(iPaS) for Next Generation High Performance Computing (HPC) Applications
  

  Speaker (FLEXTalks): Marty Yano – Murata
• 2:50pm – 3:05pm PDT

  Direct patterning of micron-scale by Super Inkjet technology
  

  Speaker (FLEXTalks): Kotaro Shimizu – SIJTechnology, Inc.
• 3:05pm – 3:20pm PDT

  Complimentary PE Equipment From a Single Source
  

  Speaker (FLEXTalks): Douglas A. Schardt – Komori America Corp
• 3:20pm – 3:35pm PDT

  Next Step for Semiconductor Advanced Package (Panel-level package for RF, Power and Chiplet integration)
  

  Speaker (FLEXTalks): Yoshiaki Aizawa – AOI Electronics Co. Ltd.
• 3:35pm – 3:50pm PDT

  Flexible Electrohydraulic Actuators for the Future of Motion
  

  Speaker (FLEXTalks): Eric Acome – Artimus Robotics Inc
• 3:50pm – 4:00pm PDT

  FLEXTalks Closing Remarks
  

  Speaker (FLEXTalks): Lin Tso – SEMI Americas