Technology Fellow Merck/EMD SPRINGFIELD, PA, United States
Two key areas of PFAS use in semiconductor patterning are etch gases and materials for photolithography. For etch gases, a main concern is their global warming potential (GWP), whereas for photolithography materials, PFAS releases into wastewater are a key area of focus. This presentation will report on efforts by Merck KGaA, Darmstadt and EMD Electronics to find etch gases with lower GWP and to develop fluorine-free replacements for photolithography materials.
