As Moore's Law continues to advance, heterogenous integration of chiplets on package will be a critical technology that will increase the total number of transistors in products. As the volumes of advanced packaging manufacturing grows, both technological and supply chain challenges must be addressed to support the demands of customers. By incorporating design for supply chain principles into the R&D processes as well as the systems, tools, and data standards for heterogenous integration, the ecosystem has the opportunity to drive improvements across cost, quality, resilience, and sustainability.
