Advancements in Silicon Photonics and 3D technologies hold immense promise for enhancing AI compute capabilities, driving the pursuit of high-performance AI/ML systems while mitigating the growing power consumption concerns. Hybridized Silicon Photonics platforms are poised to enable pluggable modules up to 3.2T, while deeply integrated, co-packaged optics aim for a 100x scaling of optical interconnect performance, replacing traditional copper interconnects down to the interposer level. These advancements are enabled by hybrid bonding techniques to seamlessly integrate heterogeneous compute and memory layers with photonics for high-speed, low-power optical data transfer. Advanced Silicon Photonics and 3D Technologies set the trajectory of future of high-performance artificial intelligence compute systems.
