The semiconductor industry is transforming remarkably, spurred by the demand for more efficient packaging solutions to support cutting-edge technologies like 5G and 6G, vehicle sensor integration, and artificial intelligence (AI) applications. Enter panel-level packaging, a game-changing innovation introduced in 2016, is now gaining momentum as a central enabler for these advancements.
Our presentation is a deep dive into the potential of panel-level packaging, highlighting the pivotal role of automated precision fluid dispensing in enhancing productivity and reliability. Traditionally confined to silicon wafers of 300 mm or less in diameter, semiconductor packaging is now venturing into new territories with large panels, opening doors to heterogeneous integration, chiplets, and 3D packaging, all aimed at optimizing Power, Performance, Area, and Cost (PPAC).
With the Panel-Level Packaging Market projected to soar to USD 1.38 billion by 2029, boasting a staggering CAGR of 41.07%, the demand for integrated processing solutions has never been higher. To meet this demand head-on, Nordson has developed a fully automated panel-level fluid dispensing solution that seamlessly integrates with OHT (Overhead Hoist Transport) or AMHS (Automated Material Handling System) systems.
During our presentation, we'll tackle the critical challenges facing the underfill process in panel-level processing, including handling, transport, warpage, cycle time, and heat uniformity. We'll underscore the paramount importance of managing warpage and heat uniformity in large panels, which impedes uniform underfill dispensing and compromises reliability.
We'll delve into the following topics: 1. Unraveling the impact of warpage on reliability and performance. 2. Identifying the common hurdles posed by non-flat surfaces in underfill dispensing. 3. Understanding the intricate interplay between heat uniformity, warpage mitigation, and fluid flow during underfill dispensing. 4. Exploring the role of heat uniformity in preventing void formation and elevating reliability. 5. Gaining insights into process control and repeatability measures for optimizing heat uniformity and eliminating defects. 6. Learning about the practical challenges we overcame while developing our groundbreaking solution.
As the semiconductor industry continues its transformation, advanced automation becomes imperative for improving production speed and efficiency. Nordson's comprehensive reliability solutions empower semiconductor manufacturers to meet the demands of the evolving market landscape while maximizing throughput and yield.
Join us in exploring the future of advanced fluid dispensing through automated panel-level processing, where innovation meets efficiency to drive the industry forward.
