The presentation will review the CHIPS Manufacturing USA Institute program, which aims to deliver Digital Twin technologies for the semiconductor, advanced packaging, assembly, and test manufacturing sectors. By establishing a single institute with national reach, CHIPS R&D seeks to enable the seamless integration of digital twin models into U.S. semiconductor manufacturing, advanced packaging, assembly, and testing processes. This initiative aims to promote the rapid adoption of innovations and enhance domestic competitiveness for decades to come. The CHIPS Manufacturing USA Institute will foster a collaborative environment to significantly expand innovation, bring tangible benefits to both large and small to mid-sized manufacturers, strengthen diverse research institutions, and ensure a national reach in workforce development. The presentation will summarize the program goals.
