The Semiconductor industry is projected to experience remarkable growth, with revenues expected to surpass one trillion dollars by 2030. This surge necessitates a significant increase in production capacity, including the construction of nearly 80 new wafer fabrication plants and a substantial expansion of assembly and test facilities. In the realm of power and mixed signal testing, innovative testing methodologies are crucial for maximizing throughput and reducing costs, even as product portfolios diversify, and complexities increase. Achieving optimal results hinges on integrating process steps while maintaining production flexibility and development efficiency. To maximize the impact of capital spending, new tester technologies and architectures must be embraced. This presentation presents goals and metrics that can be used to achieve an optimized test floor for 2030.