It is well established that there is an impetus toward enhanced scaling through innovative solutions. The weighted benefits of performance, power, area, and cost is well documented when taking advantage of the convergence of functional capabilities through engineered substrates. This inflection brings together a diverse set of architectures and technology nodes simultaneously to offer the enhancements necessary for end market applications.
The ability to leverage material engineered substrates has a profound effect on the electrical behavior of integrated circuits. In this presentation, we will share our view on SmartCut tm technology, widely adopted for silicon on insulator (SOI), to the emerging needs of next generation applications.
