Demonstration of stretchable electronics has been an allusive goal for the FHE community for many years. Challenges towards the demonstrations of stretchable electronics includes conductive material compatibility towards stretchable substrates and maintaining appreciable conductivity at large strains (>40%). A common approach to enable stretch electronics is use of serpentine conductor geometries embedded into silicone elastomers. Although the use of these patterns has previously shown promising results, these serpentine conductive traces are not inherently strain tolerant and require appreciably larger footprint to be patterned. Additionally, silicones (like PDMS) have low surface energies that causes material incompatibility with common conductive inks, leading to flaking and delamination. Here in this presentation, we demonstrate the use of a commercialized liquid metal ink developed by AFRL and UES, ELMNT, as a candidate conductor for stretch electronics. This inherently stretchable, patented liquid metal ink was printed upon thermoplastic polyurethane through a highly scalable and high throughput manufacturing process – screen printing. Various screen print parameters such as durometer blade shape and softness, density of lines per inch, and screen material selection were explored towards trace deposition thickness and quality through optical profilometry. Additionally, resistance measurements were conducted at 0% (R¬0) and 100% (R) strain with a targeted R/R0 < 3 threshold. Partnership with Tapecon’s advanced manufacturing capability identified scalable methods for printing of ELMNT ink on stretchable thermoplastic polyurethane substrates stabilized by a non-stretchable PET liner. During the translation of techniques and designs from UES’ lab bench to Tapecon’s manufacturing process, non-thermal sintering peel activation and lamination encapsulation parameters (such as pressure, temperature, and dwell times) of the select thermoplastic polyurethane where identified. Encapsulated within the laminated liquid metal traces also included the design of interconnects that would interface with electronic components such as crimp pin connectors, solder tabs, or breakout boards. These terminal stretch-to-flex interconnect design and strategies included materials down selection based on substrate lamination and liquid metal ink compatibility. Fully assembled data cables were finally tested for mechanical and electrical conductivity robustness through a strenuous 1000 cycle strain test at 100% strain. In parallel to this measurement, resistance was also measured to ensure electrical continuity and minimized hysteresis.