Digital printing processes such as inkjet, aerosol jet, and microextrusion have been used with considerable success for a wide range of printed electronics applications. However, electrical conductivity and current carrying capacity in traces printed with nanoparticle inks are often not well suited for power electronics applications. This talk will present recent developments in an emerging process called molten metal droplet jetting (MMJ). Early MMJ efforts were limited to lower melting point metals, such as solders and aluminum alloys. However, recent advances in commercial MMJ have enabled on-demand jetting of molten silver and copper droplets to produce electrical circuit patterns on flexible substrate materials. Under optimized jetting conditions, electrical conductivity of the printed traces matches that of the bulk material. Because traces are formed via solidification of overlapping molten metal droplets, the drying and curing steps needed with nanoparticle inks are eliminated. The resulting traces are functionally equivalent to solid core copper or silver wires in which the height of the printed traces nearly matches the width. This large cross-sectional area of solid metal enables use in applications requiring high currents and/or low voltage drops. The talk will provide attendees with an overview of the MMJ process. It will then provide practical details on how process parameters, such as droplet jetting frequency and drop spacing, affect the quality of printed traces. Likewise, strategies for printing junctions and crossovers will be presented along with substrate compatibility details. Lastly, electrical performance in terms of conductivity, current carrying capacity, and temperature rise as a function of current will be presented.