Nowadays, the data deluge related to data generation, transfer, compute and storage, induces a huge increase of power consumption related to the usage of integrated circuits. New technologies and concepts are necessary to overcome the issue. Today, it becomes more and more obvious that the classical technology scaling is not enough to fulfill the requirements of the next generation IC's. Heterogeneous integration of multiple technologies is becoming mandatory if we want to improve the Performance and the associated Power efficiency. In this talk, the most recent developments regarding 3D integration (Hybrid bonding, TSVs, Self-Aligned technique, Sequential integration) will be detailed and their potential impact on the performance and the power consumption will be shown.
