Semiconductors have enabled ever-increasing efficiency in compute and storage of information, as a result of decades of cost-effective scaling of device density and generations of new device technologies. We believe that continued advances in holistic lithography will enable cost-effective scaling of semiconductor devices to continue through the rest of this decade and well into the next. We present here key developments in the lithography product portfolio including Exteme ultraviolet (EUV) lithography with 0.33 numerical-aperture (NA) manufacturing tools and the next-generation 0.55 NA (High-NA) tools, the deep ultraviolet (DUV) tools including leading-edge immersion lithography, and key innovations in metrology and computational lithography to support obtaining maximum capability from the exposure tools. The 0.33NA EUV tools are in high-volume manufacturing (HVM) with well over 200 tools shipped to customers. The 0.55NA EUV tools have now shipped to customers and are going through start-up on the way to HVM in the next few years. In high-volume manufacturing, the ultimate lithographic performance is only realized by the holistic combination of exposure systems, metrology and inspection tools, and computational lithography algorithms. This includes process window optimization during setup, accurate measurement of process capability, and active control to stay within the patterning process window. These become even more important with the tight tolerances on upcoming nodes and devices.
