Electrified, software defined autonomous vehicles offering an immersive digital experience require fast growth of the in-vehicle compute capabilities. The required compute scales beyond a single SoC capability, a problem other markets have also been facing and are solving by moving to chiplets and advanced packaging. Automotive has its specific set of environmental and functional requirements these future chiplet based designs need to address. Imec has been rallying the automotive supply chain to come together on these challenges through our ACA initiative and through collaborative research in our ACP program. During this talk we will discuss the challenges involved with chiplets and how imec sees a path forward.
