In the pursuit of next-generation semiconductor materials, the microgravity environment has emerged as a new platform for innovation. This talk, using case studies, will discuss the exciting prospects of leveraging microgravity for next-generation wide-band gap (WBG) materials. Microgravity, with its near-vacuum conditions and absence of buoyancy, facilitates defect-free fabrication, allowing exploration of novel alloy compositions. Importantly, these materials can lead to significant advancements in flexible electronics and additive processing. In the weightlessness of space, surface tension processes may eliminate voids and ensure seamless contact between dissimilar materials, revolutionizing manufacturing techniques. As we venture into low-earth orbit (LEO) and beyond, we anticipate breakthroughs that will redefine traditional manufacturing processes and open the door to new space-based technologies.
