Quantum Technology is based on photonic packages that combine active semiconductors generating single frequency radiation and photodetectors with photonic integrated circuits (PIC) for routing the photons and active components for modulating the photons. Typically, tens of individual single mode channels must be precisely controlled for constant optical path length and sensitive, high frequency feedback loops are deployed. Integrated photonic packages must be designed for properly managing the temperature distribution between passive and active optical elements as well as proper heat dissipation.
We will review the state of the art for design and execution of integrated photonic packages. Consistent, high quality die and wire bonding are routinely performed at our facility. We will report on our technologies for high efficiency optical coupling between semiconductors and fiber arrays (FAU) or photonic integrated circuits (PIC) that include butt coupling, integrated spot size converters made by ion exchange and nanoimprinted lenses that also enable surface coupling. Edge coupling and grating coupling are used in straight or angled configurations. The routing of electrical DC and RF drive current as well as sensitive RF sense currents must be laid out for minimal interference. Consistent high optical coupling efficiency of all optical channels is vital for performance.
We will discuss design rules for packaging that lead to standardized packages making downstream testing and integration more streamlines and cost effective. We will review applications from remote sensing, quantum technology and bio sensing.
We will also present our demonstrator made on a 8” wafer with more than 3,000 electrical connections.
