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Tuesday, July 9, 2024
8:00am – 6:00pm
PDT
SEMI Standards Session
8:30am – 9:30am
PDT
ESD/ESC Task Force
Location: Moscone South, Level 3, Room 305
Standards
9:00am – 10:00am
PDT
S1 (Labels) Revision Task Force
Location: Moscone South, Level 3, Room 307
Standards
9:00am – 12:00pm
PDT
Facilities & Gases North America Technical Committee Chapter Meeting
Location: Moscone South, Level 3, Room 306
Standards
9:00am – 12:00pm
PDT
Silicon Wafer North America Technical Committee Chapter Meeting
Location: Moscone South, Level 3, Room312
Standards
10:00am – 11:00am
PDT
Energy Saving Equipment Communication (ESEC) Task Force
Location: Moscone South, Level 3, Room 313
Standards
10:00am – 11:00am
PDT
S12 (Equipment Decon) Review Task Force
Location: Moscone South, Level 3, Room 307
Standards
11:00am – 12:00pm
PDT
Energetic Materials EHS Task Force
Location: Moscone South, Level 3, Room 307
Standards
11:00am – 12:00pm
PDT
Sensor Bus Task Force
Location: Moscone South, Level 3, Room 313
Standards
12:00pm – 1:00pm
PDT
Critical Chamber Components (CCC) Task Force
Location: Moscone South, Level 3, Room 305
Standards
1:00pm – 2:00pm
PDT
S6 Revision Task Force
Location: Moscone South, Level 3, Room 307
Standards
1:00pm – 3:00pm
PDT
Film Frame FOUP (FFF) Task Force
Location: Moscone South, Level 3, Room 305
Standards
1:00pm – 4:00pm
PDT
Diagnostic Data Acquisition (DDA) Task Force
Location: Moscone South, Level 3, Room 313
Standards
1:00pm – 4:00pm
PDT
Liquid Chemicals North America Technical Committee Chapter Meeting - Day 1
Location: Moscone South, Level 3, Room 306
Standards
2:00pm – 5:00pm
PDT
Control of Hazardous Energy (CoHE) Task Force
Location: Moscone South, Level 3, Room 307
Standards
3:00pm – 4:00pm
PDT
Fire Protection Task Force
Location: Moscone South, Level 3, Room 307
Standards
3:00pm – 5:30pm
PDT
Metrics North America Technical Committee Chapter Meeting
Location: Moscone South, Level 3, Room 312
Standards
3:00pm – 6:00pm
PDT
Next Gen Assembly / Test Material Handling (NGAT) Japan Task Force
Location: Moscone South, Level 3, Room 305
Standards
4:00pm – 5:00pm
PDT
S23 Revision Global Task Force
Location: Moscone South, Level 3, Room 307
Standards
4:00pm – 5:00pm
PDT
S7 Revision Task Force
Location: Moscone South, Level 3, Room 307
Standards
4:00pm – 5:30pm
PDT
Fab & Equipment Computer & Device Security (CDS) Task Force
Location: Moscone South, Level 3, Room 313
Standards
5:00pm – 5:30pm
PDT
Flammable Gas Task Force
Location: Moscone South, Level 3, Room 307
Standards
8:00am – 8:00pm
PDT
SEMI Standards Session
6:00pm – 7:30pm
PDT
SEMI Standards Awards Ceremony & Networking Event
Location: Moscone South, Level 3, Room 308
Standards
Networking
8:30am – 3:30pm
PDT
CEO Summit: Investing in America's Manufacturing Future
CEO Summit/Keynote
FLEX
8:30am – 3:30pm
PDT
CEO Summit: Investing in America's Manufacturing Future
Location: CEO Summit Stage, North Hall, Room 24
CEO Summit/Keynote
FLEX
8:30am – 8:35am
PDT
SEMICON West Welcome Remarks
Location: CEO Summit Stage, North Hall, Room 24
Keynote Moderator:
Joe Stockunas
– SEMI
CEO Summit/Keynote
FLEX
8:35am – 8:45am
PDT
SEMICON West Opening Remarks
Location: CEO Summit Stage, North Hall, Room 24
Keynote Speaker:
Ajit Manocha
– SEMI
CEO Summit/Keynote
FLEX
8:45am – 8:50am
PDT
Special Announcement
Special Guest:
The Honorable Eric J. Holcomb
Keynote Moderator:
Joe Stockunas
– SEMI
CEO Summit/Keynote
FLEX
8:50am – 9:15am
PDT
Keynote: CHIPS Act Update
Location: CEO Summit Stage, North Hall, Room 24
Keynote Speaker (CEO Summit):
Laurie E. Locascio
– National Institute of Standards and Technology, U.S. Department of Commerce
CEO Summit/Keynote
FLEX
9:15am – 9:40am
PDT
From Rust Belt to Tech Hub: How Upstate New York Came to Lead America’s Semiconductor Comeback
Location: CEO Summit Stage, North Hall, Room 24
Keynote Speaker (CEO Summit):
Kevin Younis
– Empire State Development (ESD)
CEO Summit/Keynote
FLEX
9:40am – 10:05am
PDT
Arizona: Home of America’s Semiconductor Resurgence
Location: CEO Summit Stage, North Hall, Room 24
Keynote Speaker (CEO Summit):
Sandra Watson
– Arizona Commerce Authority.
CEO Summit/Keynote
FLEX
10:05am – 10:30am
PDT
Seizing Global Opportunities
Location: CEO Summit Stage, North Hall, Room 24
Keynote Speaker (CEO Summit):
Keyvan Esfarjani
– Intel Corporation
CEO Summit/Keynote
FLEX
10:30am – 11:00am
PDT
Fireside Chat: Accelerating the US Semiconductor Ecosystem
Location: CEO Summit Stage, North Hall, Room 24
Fireside Chat Speaker (CEO Summit):
Tim Archer
– Lam Research
Fireside Chat Speaker (CEO Summit):
Thomas Caulfield
– GlobalFoundries
Fireside Chat Speaker (CEO Summit):
Mario A. Morales
– IDC
CEO Summit/Keynote
FLEX
11:00am – 11:25am
PDT
Collaborative Innovation to Accelerate Energy Efficient Compute for A.I.
Location: CEO Summit Stage, North Hall, Room 24
Keynote Speaker (CEO Summit):
Prabu Raja
– Applied Materials
CEO Summit/Keynote
FLEX
1:00pm – 1:25pm
PDT
Preparing for the Semiconductor Materials Supply Chain of 2030
Location: CEO Summit Stage, North Hall, Room 24
Keynote Speaker (CEO Summit):
Bertrand Loy
– Entegris
CEO Summit/Keynote
FLEX
1:25pm – 1:50pm
PDT
Staying Ahead of What’s Next, A Strategic Expansion
Location: CEO Summit Stage, North Hall, Room 24
Keynote Speaker (CEO Summit):
Hichem M'Saad, PhD
– ASM
CEO Summit/Keynote
FLEX
1:50pm – 2:15pm
PDT
Investing in collaboration: Stronger together in the resurgence of the semiconductor industry in the US
Location: CEO Summit Stage, North Hall, Room 24
Keynote Speaker (CEO Summit):
Kai Beckmann
– EMD Electronics
CEO Summit/Keynote
FLEX
2:15pm – 2:25pm
PDT
20 under 30 Recognition
Location: CEO Summit Stage, North Hall, Room 24
CEO Summit/Keynote
FLEX
2:25pm – 2:50pm
PDT
Fireside Chat: Securing Critical Supply Chains for the 21st Century
Location: CEO Summit Stage, North Hall, Room 24
Fireside Chat Speaker (CEO Summit):
Jose W. Fernandez
– U.S. Department of State
Fireside Chat Speaker (CEO Summit):
Joe Stockunas
– SEMI
CEO Summit/Keynote
FLEX
2:50pm – 3:15pm
PDT
Let's Get to Work: CHIPS for America's Workforce Accomplishments and Plans
Location: CEO Summit Stage, North Hall, Room 24
Keynote Speaker (CEO Summit):
Scott Jensen
– U.S. Department of Commerce
CEO Summit/Keynote
FLEX
3:15pm – 3:30pm
PDT
Closing remarks: Investing in America's Manufacturing Future
Location: CEO Summit Stage, North Hall, Room 24
Keynote Speaker:
Joe Stockunas
– SEMI
CEO Summit/Keynote
FLEX
10:30am – 12:30pm
PDT
Business Risks and Climate Change
EHS & Sustainability
10:30am – 12:00pm
PDT
Business Risks and Climate Change
Location: Sustainability Pavilion Stage, Moscone South, Exhibition Level, Room 4
EHS & Sustainability
Sponsors
10:30am – 10:50am
PDT
ESG Update
Location: Sustainability Pavilion Stage, Moscone South, Exhibition Level, Room 4
Speaker (Sus):
Vibhor Pradeep Chandra
– Deloitte
EHS & Sustainability
10:50am – 11:30am
PDT
Panel: Navigating Complexity in Climate Risk Management
Location: Sustainability Pavilion Stage, Moscone South, Exhibition Level, Room 4
Panelist (Sus):
Alua Suleimenova
– Marvell Technology
Panelist (Sus):
Michael Stiller
– Nasdaq
Panelist (Sus):
Jami Haaning
– Lam Research
Panelist (Sus):
Justin Murrill
– AMD
Panel Moderator (Sus):
Mousumi Bhat, PhD
– SEMI
EHS & Sustainability
11:30am – 12:00pm
PDT
Keynote: A defining moment – climate, energy and new business risks
Location: Sustainability Pavilion Stage, Moscone South, Exhibition Level, Room 4
Speaker (Sus):
Mark Patel
– McKinsey & Company
EHS & Sustainability
10:30am – 12:30pm
PDT
FLEX Keynotes
Session Chair (FLEX):
Melissa Grupen-Shemansky
– SEMI
FLEX
10:30am – 12:30pm
PDT
FLEX Keynotes
Location: Moscone South, Level 3, Room 301
Session Chair (FLEX):
Melissa Grupen-Shemansky
– SEMI
FLEX
10:30am – 10:45am
PDT
Welcome to the FLEX Conference
Location: Moscone South, Level 3, Room 301
Speaker (FLEX):
Melissa Grupen-Shemansky
– SEMI
FLEX
10:45am – 11:30am
PDT
Responsible Human/AI Collaboration
Location: Moscone South, Level 3, Room 301
Keynote Speaker (FLEX):
Lama Nachman
– Intel Corporation
FLEX
11:30am – 12:15pm
PDT
A Vision for Next Generation Intelligent Electric Systems
Location: Moscone South, Level 3, Room 301
Keynote Speaker (FLEX):
Ercan M. Dede
– Toyota Research Institute of North America
FLEX
12:15pm – 12:30pm
PDT
FLEX Keynotes Closing Remarks
Location: Moscone South, Level 3, Room 301
Speaker (FLEX):
Melissa Grupen-Shemansky
– SEMI
FLEX
10:30am – 12:30pm
PDT
FLEXTalks
Session Moderator (FLEX):
Lin Tso
– SEMI Americas
FLEX
10:30am – 12:30pm
PDT
FLEXTalks
Location: FLEXTalks Theater, Moscone South, Exhibition Level, Hall C
Session Moderator (FLEX):
Lin Tso
– SEMI Americas
FLEX
10:30am – 10:35am
PDT
Welcome to FLEXTalks
Location: FLEXTalks Theater, Moscone South, Exhibition Level, Hall C
Speaker (FLEXTalks):
Lin Tso
– SEMI Americas
10:35am – 10:50am
PDT
Printed Electronics as Sustainable Solutions
Location: FLEXTalks Theater, Moscone South, Exhibition Level, Hall C
Speaker (FLEXTalks):
Masaaki Sugimoto
– Elephantech Inc
FLEX
10:50am – 11:05am
PDT
Aerosol Printing with Industrial Stability
Location: FLEXTalks Theater, Moscone South, Exhibition Level, Hall C
Speaker (FLEXTalks):
Dov Phillips
– IDS
FLEX
11:05am – 11:20am
PDT
Desktop PCB Fabrication - Additively Manufactured
Location: FLEXTalks Theater, Moscone South, Exhibition Level, Hall C
Speaker (FLEXTalks):
Afnan Islam
– BotFactory Inc.
FLEX
11:20am – 11:35am
PDT
High-Energy, PFA-free, Lithium Cobalt Oxide Batteries Charged with RaiCore Electrodes
Location: FLEXTalks Theater, Moscone South, Exhibition Level, Hall C
Speaker (FLEXTalks):
Rajan Kumar
– Ateios Systems
FLEX
11:35am – 11:50am
PDT
Printed Circuitry and Bonding of Functional Components to TPU for a Wearable Biosensor Device
Location: FLEXTalks Theater, Moscone South, Exhibition Level, Hall C
Speaker (FLEXTalks):
John M. Yundt
– SunRay Scientific Inc.
FLEX
11:50am – 12:05pm
PDT
New Trends in Reliability for Additive Electronics
Location: FLEXTalks Theater, Moscone South, Exhibition Level, Hall C
Speaker (FLEXTalks):
Eisuke Tsuyuzaki
– Bayflex Solutions
FLEX
12:05pm – 12:20pm
PDT
Capacitor and Inductor Embedded/Integrated Package Solution(iPaS) for Next Generation High Performance Computing (HPC) Applications
Location: FLEXTalks Theater, Moscone South, Exhibition Level, Hall C
Speaker (FLEXTalks):
Marty Yano
– Murata
FLEX
12:20pm – 12:30pm
PDT
FLEXTalks Wrap up Morning Session
Location: FLEXTalks Theater, Moscone South, Exhibition Level, Hall C
Speaker (FLEXTalks):
Lin Tso
– SEMI Americas
FLEX
10:30am – 12:30pm
PDT
Synergies Unveiled: Unleashing the Potential of AI/ML in Revolutionizing Electronic Materials Manufacturing
Materials
10:30am – 12:30pm
PDT
Synergies Unveiled: Unleashing the Potential of AI/ML in Revolutionizing Electronic Materials Manufacturing
Location: TechTALKS Stage, Moscone South, Exhibition Level, Room 7
Materials
10:30am – 10:35am
PDT
Welcome Remarks
Location: TechTALKS Stage, Moscone South, Exhibition Level, Room 7
Session Moderator (Materials):
Samira Bagheri
– EMD Electronics
Materials
10:35am – 11:00am
PDT
Unlocking New Possibilities with AI in the Semiconductor Industry
Location: TechTALKS Stage, Moscone South, Exhibition Level, Room 7
Speaker (Materials):
Laura Matz
– Athinia Technologies
Materials
11:00am – 11:20am
PDT
AI/ML as an Innovation Accelerator in Semiconductor Chemicals R&D
Location: TechTALKS Stage, Moscone South, Exhibition Level, Room 7
Speaker (Materials):
Ross Fu
– EMD Electronics
Materials
11:20am – 11:40am
PDT
AI accelerated Materials Engineering
Location: TechTALKS Stage, Moscone South, Exhibition Level, Room 7
Speaker (Materials):
Shalini Sharma
– Applied Materials
Materials
11:40am – 12:00pm
PDT
Opportunities landscape for AI/ML and Semiconductor Materials Quality in High Volume Manufacturing
Location: TechTALKS Stage, Moscone South, Exhibition Level, Room 7
Speaker (Materials):
Pawitter Mangat
– GlobalFoundries
Materials
12:00pm – 12:25pm
PDT
Panel Discussion: Synergies Unveiled: Unleashing the Potential of AI/ML in Revolutionizing Electronic Materials Manufacturing
Location: TechTALKS Stage, Moscone South, Exhibition Level, Room 7
Panel Moderator (Materials):
Kevin J. McLaughlin
– KJMcLaughlin Consulting LLC
Panelist (Materials):
Laura Matz
– Athinia Technologies
Panelist (Materials):
Pawitter Mangat
– GlobalFoundries
Panelist (Materials):
Shalini Sharma
– Applied Materials
Panelist (Materials):
Ross Fu
– EMD Electronics
Materials
12:25pm – 12:30pm
PDT
Closing Remarks
Location: TechTALKS Stage, Moscone South, Exhibition Level, Room 7
Session Moderator (Materials):
Kevin J. McLaughlin
– KJMcLaughlin Consulting LLC
Materials
10:30am – 12:40pm
PDT
Smart Manufacturing Session 1: Digital Twins for Design & Manufacturing
Smart Manufacturing
10:30am – 12:40pm
PDT
Smart Manufacturing Session 1: Digital Twins for Design & Manufacturing
Location: North Hall, Expo Floor, Smart Manufacturing Pavilion Stage
Smart Manufacturing
10:30am – 10:35am
PDT
Welcome Remarks
Location: North Hall, Expo Floor, Smart Manufacturing Pavilion Stage
Session Moderator (SMfg):
Ranjan Chatterjee
– PDF Solutions
Smart Manufacturing
10:35am – 10:55am
PDT
Evolving Digital Twins: Past Milestones and Future Aspirations towards Autonomy in Semiconductor Manufacturing
Location: North Hall, Expo Floor, Smart Manufacturing Pavilion Stage
Speaker (SMfG):
John R. Behnke
– Inficon
Smart Manufacturing
10:55am – 11:15am
PDT
One Digital Twin for Semiconductor Manufacturing? Semiverse™ Solutions & Building the Digital Family
Location: North Hall, Expo Floor, Smart Manufacturing Pavilion Stage
Speaker (SMfG):
Joseph Ervin
– Lam Research
Smart Manufacturing
11:15am – 11:35am
PDT
Extending Digital Twins for Semiconductor Capital Equipment
Location: North Hall, Expo Floor, Smart Manufacturing Pavilion Stage
Speaker (SMfG):
Chris Taylor
– Athinia Technologies LLC
Speaker (SMfG):
John Solis
– TEL
Smart Manufacturing
11:35am – 11:55am
PDT
Empowering the Smart Manufacturing Citizen Data Scientist
Location: North Hall, Expo Floor, Smart Manufacturing Pavilion Stage
Speaker (SMfG):
Alan Weber
– Cimetrix by PDF Solutions
Smart Manufacturing
11:55am – 12:15pm
PDT
The Application of AI-Enabled Spatial Intelligence in Semiconductor Fabs
Location: North Hall, Expo Floor, Smart Manufacturing Pavilion Stage
Speaker (SMfG):
Amin Arbabian
– Plato Systems
Smart Manufacturing
12:15pm – 12:35pm
PDT
AI-enabled Supply Chain Resiliency and Manufacturing Intelligence in the Semiconductor Industry
Location: North Hall, Expo Floor, Smart Manufacturing Pavilion Stage
Speaker (SMfG):
Sam Wood
– EMD Electronics
Speaker (SMfG):
Andreas Baron
– EMD Electronics
Smart Manufacturing
12:35pm – 12:40pm
PDT
Closing Remarks
Location: North Hall, Expo Floor, Smart Manufacturing Pavilion Stage
Session Moderator (SMfg):
Ranjan Chatterjee
– PDF Solutions
Smart Manufacturing
10:30am – 5:00pm
PDT
Fostering an Inclusive and Equitable Workforce
Workforce Development and DEIB
10:30am – 5:00pm
PDT
Fostering an Inclusive and Equitable Workforce
Location: Workforce Development Pavilion Stage – North Hall
Workforce Development and DEIB
10:30am – 10:55am
PDT
Connecting Talent With Opportunity - SEMI Foundation's Workforce Development Initiatives
Location: Workforce Development Pavilion Stage – North Hall
Speaker (WFD):
Shari Liss
– SEMI Foundation
Speaker (WFD):
Michelle Williams-Vaden
– SEMI Foundation
Workforce Development and DEIB
11:00am – 11:55am
PDT
Semiconductor PRIDE: Raising Awareness and Creating Greater Inclusion in the Workplace
Location: Workforce Development Pavilion Stage – North Hall
Panel Moderator (WFD):
Patrick Gillen
– SEMI Foundation
Panelist (WFD):
Alejandra Caballero
– Applied Materials
Panelist (WFD):
Erin Rasmussen
– Intel Corporation
Panelist (WFD):
Caleb Edwards
– Micron Technology
Panelist (WFD):
Jeannie Jesson
– WGNSTAR
Workforce Development and DEIB
12:00pm – 12:30pm
PDT
Fostering a Dynamic Workforce
Location: Workforce Development Pavilion Stage – North Hall
Speaker (WFD):
Isabella Drolz
– Comet AG
Workforce Development and DEIB
1:00pm – 1:25pm
PDT
CHIPS for America - Creating Lasting and Inclusive Workforce Development Opportunities
Location: Workforce Development Pavilion Stage – North Hall
Panel Moderator (WFD):
Shari Liss
– SEMI Foundation
Panelist (WFD):
Ramona Prioleau
– CHIPS for America
Workforce Development and DEIB
1:30pm – 1:55pm
PDT
Bridging the Gender Gap through Grassroots Initiatives Led by Women
Location: Workforce Development Pavilion Stage – North Hall
Speaker (WFD):
Samira Bagheri
– EMD Electronics
Speaker (WFD):
Joy Racowski
– EMD Electronics
Workforce Development and DEIB
2:00pm – 2:25pm
PDT
Developing the Next Generation of Diverse Talent for Advanced Manufacturing
Location: Workforce Development Pavilion Stage – North Hall
Speaker (WFD):
Chris Suozzi
– Genesee County EDC
Workforce Development and DEIB
2:30pm – 2:55pm
PDT
SCAN (SEMI Career & Apprenticeship Network) - Making Jobs in the Semiconductor Industry Accessible to All
Location: Workforce Development Pavilion Stage – North Hall
Speaker (WFD):
Rick VanIttersum
– SEMI Foundation
Panelist (WFD):
Mike Hill
– Applied Materials
Workforce Development and DEIB
3:00pm – 3:25pm
PDT
Building an Intentional and Inclusive Talent Ecosystem
Location: Workforce Development Pavilion Stage – North Hall
Panel Moderator (WFD):
Katy Crist
– Synopsys
Panelist (WFD):
Alyssa Reinhart
– Texas Institute for Electronics (TIE)
Panelist (WFD):
Garrett Groves
– Austin Community College
Panelist (WFD):
Alexis Flores
– ARMA (Austin Regional Manufacturing Association)
Workforce Development and DEIB
3:30pm – 4:15pm
PDT
SEMI VetWorks: Diversity through Military Hiring
Location: Workforce Development Pavilion Stage – North Hall
Speaker (WFD):
Melinda Gomez
– SEMI Foundation
Speaker (WFD):
Alexis Rose
– Edwards Vacuum
Speaker (WFD):
George Ramsey, III
– Micron Technology, Inc.
Workforce Development and DEIB
4:20pm – 5:00pm
PDT
Finding and Keeping Talent: Creating Inclusive Recruitment and Retention Strategies
Location: Workforce Development Pavilion Stage – North Hall
Speaker (WFD):
William Bronner
– NY CREATES
Speaker (WFD):
Justin Rivers
– NY CREATES
Workforce Development and DEIB
11:30am – 3:30pm
PDT
FLEX Gathering at the Taste of San Francisco
12:30pm – 1:30pm
PDT
FLEX Gathering at the Taste of San Francisco
Location: Moscone South, Expo Floor
FLEX
11:30am – 3:30pm
PDT
Food Trucks Open
11:30am – 3:30pm
PDT
Food Trucks Open
Networking
11:30am – 3:30pm
PDT
Taste of San Francisco: The Mission
11:30am – 3:30pm
PDT
Taste of San Francisco: The Mission
Location: Taste of San Francisco, South Hall, Expo Floor
Networking
12:40pm – 2:00pm
PDT
CXO panel: Can AI/GenAI + Digital Twin Transform Semiconductor Manufacturing?
Panel Moderator (SMfg):
Bobby Mitra, PhD
– Deloitte
Panelist (SMfg):
Surya Iyer
– Polar Semiconductor
Panelist (SMfg):
Pradip Singh
– GlobalFoundries
Panelist (SMfg):
Jae Yong J. Park
– Samsung
Panelist (SMfg):
Dan Gamota
– Jabil
Smart Manufacturing
12:40pm – 2:00pm
PDT
CXO Panel: Can AI/GenAI + Digital Twin Transform Semiconductor Manufacturing?
Location: North Hall, Expo Floor, Smart Manufacturing Pavilion Stage
Panel Moderator (SMfg):
Bobby Mitra, PhD
– Deloitte
Panelist (SMfg):
Surya Iyer
– Polar Semiconductor
Panelist (SMfg):
Pradip Singh
– GlobalFoundries
Panelist (SMfg):
Jae Yong J. Park
– Samsung
Panelist (SMfg):
Dan Gamota
– Jabil
Smart Manufacturing
1:00pm – 2:45pm
PDT
Energy: Tripling Up and Doubling Down
EHS & Sustainability
1:00pm – 2:45pm
PDT
Energy: Tripling Up and Doubling Down
Location: Sustainability Pavilion Stage, Moscone South, Exhibition Level, Room 4
EHS & Sustainability
1:00pm – 1:20pm
PDT
Semiconductors and Sustainability: An Investor's Perspective
Location: Sustainability Pavilion Stage, Moscone South, Exhibition Level, Room 4
Speaker (Sus):
Oisin McNeela
– Generation Investment Management
EHS & Sustainability
1:20pm – 1:40pm
PDT
Energy Outlook and Perspective for the Industry
Location: Sustainability Pavilion Stage, Moscone South, Exhibition Level, Room 4
Speaker (Sus):
David Brule
– TotalEnergies
EHS & Sustainability
1:40pm – 2:00pm
PDT
Accessing low-carbon energy in APAC – challenges and opportunities
Location: Sustainability Pavilion Stage, Moscone South, Exhibition Level, Room 4
Speaker (Sus):
Ricardo Reina Garcia
– McKinsey & Company
EHS & Sustainability
2:00pm – 2:45pm
PDT
Panel: Procuring Renewable Energy
Location: Sustainability Pavilion, Moscone South, Exhibition Level, Room 3
Panel Moderator (Sus):
Jamie Belliveau
– SEMI
Panelist (Sus):
Eric Jen
– Ren
Panelist (Sus):
Henri Berthe
– Schneider Electric
Panelist (Sus):
Lauren Tatsuno
– 3Degrees
Panelist (Sus):
Katharina Westrich
– Siemens
EHS & Sustainability
1:00pm – 4:00pm
PDT
PFAS Initiative Working Session
1:00pm – 4:00pm
PDT
PFAS Initiative Working Session
Location: Moscone South, Exhibition Level Room 8
EHS & Sustainability
1:30pm – 3:00pm
PDT
FLEX Session 2: Testing and Reliability
Session Chair (FLEX):
Christopher Tabor
– Air Force Research Laboratory
FLEX
1:30pm – 3:00pm
PDT
FLEX Session 2: Testing and Reliability
Location: Moscone South, Level 3, Room 301
Session Chair (FLEX):
Christopher Tabor
– Air Force Research Laboratory
FLEX
1:30pm – 2:00pm
PDT
Dynamic Harsh Environmental FHE Reliability Testing (DHERT)
Location: Moscone South, Level 3, Room 301
Speaker (FLEX):
Douglas R. Hackler, Sr.
– American Semiconductor
FLEX
2:00pm – 2:30pm
PDT
Investigation of Possible Accelerated Temperature Cycling Test Methods
Location: Moscone South, Level 3, Room 301
Speaker (FLEX):
Daniel M. Kwak
– Henkel Corporation
FLEX
2:30pm – 3:00pm
PDT
Customized mechanical testing for characterizing fatigue performance of flexible electronics
Location: Moscone South, Level 3, Room 301
Speaker (FLEX):
Diana D. Chin
– Exponent
Speaker (FLEX):
Shuyang Fang
– Exponent
FLEX
1:30pm – 3:00pm
PDT
FLEX Session 3: New Frontiers in FHE Applications I
Session Chair (FLEX):
Rafael D. Tudela, IV
– Tapecon
FLEX
1:30pm – 3:00pm
PDT
FLEX Session 3: New Frontiers in FHE Applications I
Location: Moscone South, Level 3, Room 302
Session Chair (FLEX):
Rafael D. Tudela, IV
– Tapecon
FLEX
1:30pm – 2:00pm
PDT
Multi-layer Flexible Displays using Electroluminescent Ink
Location: Moscone South, Level 3, Room 302
Speaker (FLEX):
Katarina Ilić
– Voltera
FLEX
2:00pm – 2:30pm
PDT
Flexible Electrohydraulic Actuators for the Future of Motion
Location: Moscone South, Level 3, Room 302
Speaker (FLEX):
Eric Acome
– Artimus Robotics Inc
FLEX
2:30pm – 3:00pm
PDT
Transparent Heater Films-Development and Design
Location: Moscone South, Level 3, Room 302
Speaker (FLEX):
Johann Rindisbacher
– Chasm Advanced Materials
FLEX
2:00pm – 4:00pm
PDT
FLEXTalks
Session Moderator (FLEX):
Lin Tso
– SEMI Americas
FLEX
2:00pm – 4:00pm
PDT
FLEXTalks
Location: FLEXTalks Theater, Moscone South, Exhibition Level, Hall C
Session Moderator (FLEX):
Lin Tso
– SEMI Americas
FLEX
2:00pm – 2:05pm
PDT
Welcome to FLEXTalks
Location: FLEXTalks Theater, Moscone South, Exhibition Level, Hall C
Speaker (FLEXTalks):
Lin Tso
– SEMI Americas
FLEX
2:05pm – 2:20pm
PDT
Flex, Rigidflex, Design, Manufacturing and In-house Assembly
Location: FLEXTalks Theater, Moscone South, Exhibition Level, Hall C
Speaker (FLEXTalks):
Mike Morando
– PFC Flexible Circuits
FLEX
2:20pm – 2:35pm
PDT
BioMEMS and FLEX Electronics: Medical FLEX Applications and a Foundry to Serve Them
Location: FLEXTalks Theater, Moscone South, Exhibition Level, Hall C
Speaker (FLEXTalks):
Mark Hettick
– Precision
FLEX
2:35pm – 2:50pm
PDT
Capacitor and Inductor Embedded/Integrated Package Solution(iPaS) for Next Generation High Performance Computing (HPC) Applications
Location: FLEXTalks Theater, Moscone South, Exhibition Level, Hall C
Speaker (FLEXTalks):
Marty Yano
– Murata
FLEX
2:50pm – 3:05pm
PDT
Direct patterning of micron-scale by Super Inkjet technology
Location: FLEXTalks Theater, Moscone South, Exhibition Level, Hall C
Speaker (FLEXTalks):
Kotaro Shimizu
– SIJTechnology, Inc.
FLEX
3:05pm – 3:20pm
PDT
Complimentary PE Equipment From a Single Source
Location: FLEXTalks Theater, Moscone South, Exhibition Level, Hall C
Speaker (FLEXTalks):
Douglas A. Schardt
– Komori America Corp
FLEX
3:20pm – 3:35pm
PDT
Next Step for Semiconductor Advanced Package (Panel-level package for RF, Power and Chiplet integration)
Location: FLEXTalks Theater, Moscone South, Exhibition Level, Hall C
Speaker (FLEXTalks):
Yoshiaki Aizawa
– AOI Electronics Co. Ltd.
FLEX
3:35pm – 3:50pm
PDT
Flexible Electrohydraulic Actuators for the Future of Motion
Location: FLEXTalks Theater, Moscone South, Exhibition Level, Hall C
Speaker (FLEXTalks):
Eric Acome
– Artimus Robotics Inc
FLEX
3:50pm – 4:00pm
PDT
FLEXTalks Closing Remarks
Location: FLEXTalks Theater, Moscone South, Exhibition Level, Hall C
Speaker (FLEXTalks):
Lin Tso
– SEMI Americas
FLEX
2:00pm – 4:15pm
PDT
Material Innovations for Advancing Design Optimization
Materials
2:00pm – 4:15pm
PDT
Material Innovations for Advancing Design Optimization
Location: TechTALKS Stage, Moscone South, Exhibition Level, Room 7
Materials
2:00pm – 2:05pm
PDT
Welcome Remarks and Session Overview
Location: TechTALKS Stage, Moscone South, Exhibition Level, Room 7
Session Moderator (AdvS):
Patrick M. Martin
– Soitec
Materials
2:05pm – 2:30pm
PDT
Materials Innovation for Semiconductors: The Journeys Ahead and Beyond
Location: TechTALKS Stage, Moscone South, Exhibition Level, Room 7
Speaker (AdvS):
Dave Thompson
– Intel
Materials
2:30pm – 3:30pm
PDT
Roadmaps and Updates on SOI and Advanced Substrates
Location: TechTALKS Stage, Moscone South, Exhibition Level, Room 7
Materials
2:30pm – 2:40pm
PDT
Enhancing FDSOI using a Buried Stressor
Location: TechTALKS Stage, Moscone South, Exhibition Level, Room 7
Speaker (AdvS):
Paul A. Clifton
– Acorn Semi LLC.
Materials
2:40pm – 2:50pm
PDT
SSROI (Super-Steep Retrograde on Insulator) Substrates for RF Switch and LNA Device Performance Enhancement
Location: TechTALKS Stage, Moscone South, Exhibition Level, Room 7
Speaker (AdvS):
Hideki Takeuchi
– Atomera
Materials
2:50pm – 3:00pm
PDT
A Dive Into Various Wafer Types for Optimal RF Performance
Location: TechTALKS Stage, Moscone South, Exhibition Level, Room 7
Speaker (AdvS):
Madhavan Esayanur
– MEMC/GlobalWafers
Materials
3:00pm – 3:10pm
PDT
Large Diameter, Scalable, and CMOS Friendly GaN-on-QST® Manufacturing Platform for Electronic and Optoelectronic Devices
Location: TechTALKS Stage, Moscone South, Exhibition Level, Room 7
Speaker (AdvS):
Vladimir Odnoblyudov
– Qromis, Inc.
Materials
3:10pm – 3:20pm
PDT
Silicon Wafers Enabling 5G and 6G Technologies
Location: TechTALKS Stage, Moscone South, Exhibition Level, Room 7
Speaker (AdvS):
Jim Reed
– Okmetic
Materials
3:20pm – 3:30pm
PDT
Materials Enablement
Location: TechTALKS Stage, Moscone South, Exhibition Level, Room 7
Speaker (AdvS):
Patrick M. Martin
– Soitec
Materials
3:30pm – 4:05pm
PDT
Panel: Monolithic Integration Beyond Heterogeneous Integration (HI)
Location: TechTALKS Stage, Moscone South, Exhibition Level, Room 7
Session Moderator (AdvS):
Ed Sperling
– Semiconductor Engineering
Panelist (AdvS):
Jamie Schaeffer
– GlobalFoundries
Panelist (AdvS):
Dechao Guo
– IBM
Panelist (AdvS):
Dave Thompson
– Intel
Panelist (AdvS):
Mustafa Badaroglu
– Qualcomm
Panelist (AdvS):
Thomas Ponnuswamy
– Lam Research
Materials
4:05pm – 4:15pm
PDT
Session Wrap-up and Closing Remarks
Location: TechTALKS Stage, Moscone South, Exhibition Level, Room 7
Session Moderator (AdvS):
Patrick M. Martin
– Soitec
Materials
2:00pm – 4:55pm
PDT
Smart Manufacturing Session 2: Front-End Manufacturing - Optimizing Yield with AI
Smart Manufacturing
2:00pm – 4:35pm
PDT
Smart Manufacturing Session 2: Front-End Manufacturing - Optimizing Yield with AI
Location: North Hall, Expo Floor, Smart Manufacturing Pavilion Stage
Smart Manufacturing
2:00pm – 2:05pm
PDT
Welcome Remarks
Location: North Hall, Expo Floor, Smart Manufacturing Pavilion Stage
Session Moderator (SMfg):
Doug Suerich
– PEER Group
Smart Manufacturing
2:05pm – 2:30pm
PDT
Keynote: Leveraging Generative AI for Advanced Equipment Data Analytics in Semiconductor Manufacturing
Location: North Hall, Expo Floor, Smart Manufacturing Pavilion Stage
Speaker (SMfG):
Jae Yong J. Park
– Samsung
Smart Manufacturing
2:30pm – 2:50pm
PDT
Deep Topological Data Analysis and Self-Supervised Learning for Semiconductor Image Analytics
Location: North Hall, Expo Floor, Smart Manufacturing Pavilion Stage
Speaker (SMfG):
Janhavi Giri
– Intel Corporation
Smart Manufacturing
2:50pm – 3:10pm
PDT
ML Based Virtual Metrology for Advanced Process Control for Improved High Product Mix Manufacturing
Location: North Hall, Expo Floor, Smart Manufacturing Pavilion Stage
Speaker (SMfG):
Srividya Jayaram
– Siemens Digital Industries Software
Smart Manufacturing
3:10pm – 3:30pm
PDT
Applying Artificial Intelligence in Fab Technology Co-Optimization
Location: North Hall, Expo Floor, Smart Manufacturing Pavilion Stage
Speaker (SMfG):
Jin Cho
– Silvaco
Smart Manufacturing
3:30pm – 3:50pm
PDT
Revolutionizing Semiconductor Manufacturing with AI Agents Powered by SemiKong, the First Open-Source Semiconductor Industry LLM
Location: North Hall, Expo Floor, Smart Manufacturing Pavilion Stage
Speaker (SMfG):
Christopher Nguyen
– Aitomatic
Speaker (SMfG):
Daisuke Oku
– Tokyo Electron Limited
Smart Manufacturing
3:50pm – 4:10pm
PDT
Enhanced Critical Defect Detection Using Machine Learning Based Guided Electron Beam Review Strategy
Location: North Hall, Expo Floor, Smart Manufacturing Pavilion Stage
Speaker (SMfG):
Naor Alfassi
– Applied Materials
Smart Manufacturing
4:10pm – 4:30pm
PDT
From Lab to Fab: AI-Powered Metrology for High-Volume Manufacturing
Location: North Hall, Expo Floor, Smart Manufacturing Pavilion Stage
Speaker (SMfG):
Mike Y. H Kim
– Gauss Labs
Smart Manufacturing
4:30pm – 4:50pm
PDT
Optimizing semiconductor manufacturing with AI: from Tool-level and WIP predictions to fab scheduling
Location: North Hall, Expo Floor, Smart Manufacturing Pavilion Stage
Speaker (SMfG):
Sumit Sanyal, BTech
– minds.ai
Smart Manufacturing
4:50pm – 4:55pm
PDT
Closing Remarks
Location: North Hall, Expo Floor, Smart Manufacturing Pavilion Stage
Session Moderator (SMfg):
Doug Suerich
– PEER Group
Smart Manufacturing
3:00pm – 3:30pm
PDT
FLEX Student Poster Networking Break
FLEX
3:00pm – 3:30pm
PDT
FLEX Student Poster Networking Break
Location: Moscone South, Level 3, Room 303
FLEX
3:00pm – 5:00pm
PDT
Bringing Circular Economy to the Value Chain
EHS & Sustainability
3:00pm – 5:00pm
PDT
Bringing Circular Economy to the Value Chain
Location: Sustainability Pavilion Stage, Moscone South, Exhibition Level, Room 4
EHS & Sustainability
3:00pm – 3:05pm
PDT
Welcome Remarks and Session Overview
Location: Sustainability Pavilion Stage, Moscone South, Exhibition Level, Room 4
Session Moderator (Sus):
David Medeiros
– Entegris
EHS & Sustainability
3:05pm – 3:25pm
PDT
Session Keynote: Valure Recovery from Used Electronics: A Lesson in Grit
Location: Sustainability Pavilion Stage, Moscone South, Exhibition Level, Room 4
Speaker (Sus):
Carol Handwerker
– Purdue University
EHS & Sustainability
3:25pm – 3:45pm
PDT
Water in Fabs of the Future
Location: Sustainability Pavilion Stage, Moscone South, Exhibition Level, Room 4
Speaker (Sus):
Nate Haralson
– Gradiant
EHS & Sustainability
3:45pm – 4:05pm
PDT
Material circularity throughout the semiconductor value chain
Location: Sustainability Pavilion Stage, Moscone South, Exhibition Level, Room 4
Speaker (Sus):
Emily Gallagher
– imec
EHS & Sustainability
4:05pm – 4:25pm
PDT
Navigating the Path to Zero Waste in Semiconductor Industry
Location: Sustainability Pavilion Stage, Moscone South, Exhibition Level, Room 4
Speaker (Sus):
Vaishnav Raj Kanagaraj Subramanian
– GlobalFoundries
EHS & Sustainability
4:25pm – 4:45pm
PDT
Quantifying and Benchmarking Water and Waste Stewardship Across Semiconductor Value Chain
Location: Sustainability Pavilion Stage, Moscone South, Exhibition Level, Room 4
Speaker (Sus):
John A. Howarter, PhD
– Purdue University
EHS & Sustainability
3:00pm – 5:00pm
PDT
Welcome Remarks and Session Overview
3:00pm – 3:05pm
PDT
Welcome Remarks and Session Overview
Location: Sustainability Pavilion Stage, Moscone South, Exhibition Level, Room 4
EHS & Sustainability
3:30pm – 4:30pm
PDT
FLEX Session 4: Manufacturing Process Innovations I
Session Chair (FLEX):
Eisuke Tsuyuzaki
– Bayflex Solutions
FLEX
3:30pm – 4:30pm
PDT
FLEX Session 4: Manufacturing Process Innovations I
Location: Moscone South, Level 3, Room 301
Session Chair (FLEX):
Eisuke Tsuyuzaki
– Bayflex Solutions
FLEX
3:30pm – 4:00pm
PDT
Increased Functionality for IoT through Direct Die Attach of Wire-bondable Chips on Flexible Hybrid Electronics (FHE)
Location: Moscone South, Level 3, Room 301
Speaker (FLEX):
John M. Yundt
– SunRay Scientific Inc.
FLEX
4:00pm – 4:30pm
PDT
Advanced Hybrid Additive Manufacturing Software & Processes for Volumetric FHEs
Location: Moscone South, Level 3, Room 301
Speaker (FLEX):
Gilbert T. Carranza
– Kraetonics, LLC
FLEX
3:30pm – 4:30pm
PDT
FLEX Session 5: Material Breakthroughs
Session Chair (FLEX):
Samira Bagheri
– EMD Electronics
FLEX
3:30pm – 4:30pm
PDT
FLEX Session 5: Material Breakthroughs
Location: Moscone South, Level 3, Room 302
Session Chair (FLEX):
Samira Bagheri
– EMD Electronics
FLEX
3:30pm – 4:00pm
PDT
Printed opto-electronic devices based on nanomaterial semiconductor inks
Location: Moscone South, Level 3, Room 302
Speaker (FLEX):
Chad Husko
– Iris Light Technologies, Inc.
FLEX
4:00pm – 4:30pm
PDT
Sustainable Additive Process-Performance Interactions with Biodegradable and Water-Based Materials
Location: Moscone South, Level 3, Room 302
Speaker (FLEX):
Pradeep Lall
– Auburn University
FLEX
4:00pm – 5:00pm
PDT
Women In Technology Reception
4:00pm – 5:00pm
PDT
Women In Technology Reception
Location: Moscone North, Exhibit Hall, Beer & Wine Garden
Networking
Sponsor
4:00pm – 5:30pm
PDT
SMG Markets & Materials Reception
4:00pm – 5:30pm
PDT
SMG Markets & Materials Reception
Location: Moscone South, Upper Mezzanine, Room 160
Networking
4:30pm – 5:30pm
PDT
FLEX Funding Opportunities
FLEX
4:30pm – 5:30pm
PDT
FLEX Funding Opportunities
Location: Moscone South, Level 3, Room 301
FLEX
4:30pm – 4:35pm
PDT
Welcome Remarks
Location: Moscone South, Level 3, Room 301
Speaker (FLEX):
Melissa Grupen-Shemansky
– SEMI
FLEX
4:35pm – 4:55pm
PDT
Overview of the FlexTech and NBMC R&D Programs
Location: Moscone South, Level 3, Room 301
Speaker (FLEX):
Gity Samadi
– SEMI
4:55pm – 5:10pm
PDT
Overview of the NextFlex Manufacturing Institute Programs
Location: Moscone South, Level 3, Room 301
Speaker (FLEX):
Scott M. Miller
– NextFlex
FLEX
5:10pm – 5:15pm
PDT
Other Funding Opportunities
Location: Moscone South, Level 3, Room 301
Speaker (FLEX):
Melissa Grupen-Shemansky
– SEMI
FLEX
5:15pm – 5:30pm
PDT
Networking and Connecting to Projects
Location: Moscone South, Level 3, Room 301
FLEX
4:30pm – 6:00pm
PDT
Sustainability Reception
5:00pm – 6:00pm
PDT
Sustainability Reception
Location: Sustainability Pavilion Stage, Moscone South, Exhibition Level, Room 4
EHS & Sustainability
Networking
Sponsors
4:35pm – 5:45pm
PDT
Smart Manufacturing Special Session: Digital Twin Manufacturing USA Institute
Smart Manufacturing
4:35pm – 5:45pm
PDT
Smart Manufacturing Special Session: Digital Twin Manufacturing USA Institute
Location: North Hall, Expo Floor, Smart Manufacturing Pavilion Stage
Smart Manufacturing
4:35pm – 4:40pm
PDT
Welcome Remarks
Location: North Hall, Expo Floor, Smart Manufacturing Pavilion Stage
Session Moderator (SMfg):
Sirisha Kuchimanchi, PhD
– Sahita Technologies
Smart Manufacturing
4:40pm – 5:00pm
PDT
CHIPS Manufacturing USA Institute - Digital Twin For Manufacturing
Location: North Hall, Expo Floor, Smart Manufacturing Pavilion Stage
Speaker (SMfG):
Eric Forsythe
– NIST CHIPS RD Office
Smart Manufacturing
5:00pm – 5:20pm
PDT
Accelerating the Adoption of Semiconductor Innovation with the SMART USA Institute
Location: North Hall, Expo Floor, Smart Manufacturing Pavilion Stage
Speaker (SMfG):
David Henshall
– Semiconductor Research Corp (SRC)
Smart Manufacturing
5:20pm – 5:40pm
PDT
[Cancelled] Modeling and Simulation as an Enabler for Semiconductor Digital Twins
Location: North Hall, Expo Floor, Smart Manufacturing Pavilion Stage
Speaker (SMfG):
Angela Hamilton
– UCF Institute for Simulation and Training
Smart Manufacturing
5:40pm – 5:45pm
PDT
Closing Remarks
Location: North Hall, Expo Floor, Smart Manufacturing Pavilion Stage
Session Moderator (SMfg):
Sirisha Kuchimanchi, PhD
– Sahita Technologies
Smart Manufacturing
5:30pm – 7:00pm
PDT
FLEX Reception
5:30pm – 7:00pm
PDT
FLEX Reception
Location: Moscone South, Level 3, Room 303
FLEX
Networking
10:30am – 3:50pm
PDT
Future of Computing
Smart Data-AI
10:30am – 3:50pm
PDT
Future of Computing
Location: Moscone South, Exhibition Level Room 9
Smart Data-AI
10:30am – 12:45pm
PDT
Future of Computing: Novel Architectures and Devices
Location: Moscone South, Exhibition Level Room 9
Smart Data-AI
10:30am – 10:40am
PDT
Welcome Remarks for Novel Architectures and Devices Session
Location: Moscone South, Exhibition Level Room 9
Session Moderator (FoC):
Pushkar Apte
– SEMI
Smart Data-AI
10:40am – 11:00am
PDT
The Future of AI Hardware
Location: Moscone South, Exhibition Level Room 9
Speaker (Foc):
Subhasish Mitra
– Stanford University
Smart Data-AI
11:00am – 11:20am
PDT
From Silicon to System: Unveiling Demand and Hardware Innovation Driven by GenAI
Location: Moscone South, Exhibition Level Room 9
Speaker (Foc):
Wendy Zhu
– McKinsey & Company
Smart Data-AI
11:20am – 11:40am
PDT
Future of Computing Challenges and Opportunities
Location: Moscone South, Exhibition Level Room 9
Speaker (Foc):
James Sexton
– IBM
Smart Data-AI
11:40am – 12:00pm
PDT
Future of Memory Technology
Location: Moscone South, Exhibition Level Room 9
Speaker (Foc):
Ameen Akel
– Micron Technology
Smart Data-AI
12:00pm – 12:20pm
PDT
Accelerating Intelligent Computing by Rapidly Evolving GPU AI Technology
Location: Moscone South, Exhibition Level Room 9
Speaker (Foc):
John Hu
– Nvidia
Smart Data-AI
12:20pm – 12:40pm
PDT
The Collision of Big Data, Big Compute and Big AI - The End of the Von Neumann Era
Location: Moscone South, Exhibition Level Room 9
Speaker (Foc):
Paul Master
– Cornami Inc.
Smart Data-AI
12:40pm – 12:45pm
PDT
Session Wrap-up: Novel Architectures and Devices and Closing Remarks
Location: Moscone South, Exhibition Level Room 9
Session Moderator (FoC):
Pushkar Apte
– SEMI
Smart Data-AI
12:45pm – 2:00pm
PDT
Lunch Break
Location: Moscone South, Exhibition Level Room 9
Smart Data-AI
2:00pm – 3:50pm
PDT
Future of Computing: Quantum Sensing and Computing
Location: Moscone South, Exhibition Level Room 9
Smart Data-AI
2:00pm – 2:05pm
PDT
Welcome Remarks for Quantum Sensing and Computing Session
Location: Moscone South, Exhibition Level Room 9
Session Moderator (FoC):
Pushkar Apte
– SEMI
Smart Data-AI
2:05pm – 2:30pm
PDT
New CMOS-Compatible Metamaterials for Classical and Quantum Photonics
Location: Moscone South, Exhibition Level Room 9
Speaker (Foc):
Carlos J. Augusto
– Quantum Semiconductor
Smart Data-AI
2:30pm – 2:55pm
PDT
Technologies To Scale Up Superconductive Quantum Computers
Location: Moscone South, Exhibition Level Room 9
Speaker (Foc):
Piia Konstari
– VTT Technical Research Centre of Finland
Smart Data-AI
2:55pm – 3:20pm
PDT
Quantum for Semi: Applying Quantum Computing to Semiconductor Challenges
Location: Moscone South, Exhibition Level Room 9
Speaker (Foc):
Charles Chung
– IBM
Smart Data-AI
3:20pm – 3:45pm
PDT
From Transistors to Qubits – Scalable Silicon-Based Quantum Computing
Location: Moscone South, Exhibition Level Room 9
Speaker (Foc):
Andrew Wagner
– Intel
Smart Data-AI
3:45pm – 3:50pm
PDT
Session Wrap-up: Quantum Sensing and Computing and Closing Remarks
Location: Moscone South, Exhibition Level Room 9
Session Moderator (FoC):
Pushkar Apte
– SEMI
Smart Data-AI
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