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Full Schedule

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Full Schedule

  • Wednesday, July 10, 2024
  • 8:00am – 3:20pm PDT
    CEO Summit: Seizing the Global Opportunities and Challenges Ahead
    CEO Summit/KeynoteFLEX
  • 8:00am – 6:00pm PDT
    SEMI Standards Session
  • 9:00am – 12:20pm PDT
    Test Vision Session 1: RF and Power Test Innovation
    Session Moderator (TV): Adrian Kwan – Advantest America Inc.
    Test
  • 10:00am – 12:50pm PDT
    Heterogeneous Integration: Path to Build Next Generation Systems for AI & High Performance Computing
    Heterogeneous Integration
  • 10:15am – 12:35pm PDT
    Innovation in Sustainable Semiconductor Manufacturing
    EHS & Sustainability
  • 10:30am – 12:30pm PDT
    FLEX Keynotes
    Session Chair (FLEX): Gity Samadi – SEMI
    Session Chair (FLEX): Robert F. Praino, Jr. – Chasm Advanced Materials Inc
    FLEX
  • 10:30am – 12:30pm PDT
    Photonics at Edge
    Photonics & Optoelectronics
  • 10:30am – 12:30pm PDT
    Smart Mobility: Chiplets for Automotive
    Smart Mobility
  • 10:30am – 12:45pm PDT
    Smart Manufacturing Session 3: Back-End Semiconductor Manufacturing – AI for Smart Production
    Smart Manufacturing
  • 10:30am – 4:30pm PDT
    ChipIn! The Semiconductor Industry Needs you!
    Workforce Development and DEIB
  • 10:30am – 4:45pm PDT
    Resources For Expanding Operations in The U.S.
    Supply Chain
  • 11:30am – 3:30pm PDT
    FLEX Gathering at the Taste of San Francisco
  • 11:30am – 3:30pm PDT
    Food Trucks Open
  • 11:30am – 3:30pm PDT
    Taste of San Francisco: North Beach Neighborhood
  • 12:30pm – 5:30pm PDT
    Assuring Cybersecurity Resilience Through Industry Partnership
    Cybersecurity
  • 12:45pm – 2:00pm PDT
    CXO Panel: Can AI/GenAI + Digital Twin Make Semiconductor Factory Construction Smarter?​
    Session Moderator (SMfg): Bobby Mitra, PhD – Deloitte
    Panelist (SMfg): Evann Smith – Bechtel
    Panelist (SMfg): Jerry Chen – NVIDIA
    Panelist (SMfg): Paul Connell – Hexagon
    Panelist (SMfg): Paul Fullam – Jacobs
    Panelist (SMfg): Ricky To – Exyte
    Smart Manufacturing
  • 1:00pm – 3:00pm PDT
    Innovation on Net Zero & PFAS
    EHS & Sustainability
  • 1:30pm – 3:00pm PDT
    FLEX Session 8: New Frontiers in FHE Applications II
    Session Chair (FLEX): Carolyn Ellinger – Eastman Kodak Company
    FLEX
  • 1:30pm – 3:00pm PDT
    FLEX Session 9: Developments in Printing & Other Additive Manufacturing
    Session Chair (FLEX): Scott M. Miller – NextFlex
    FLEX
  • 1:30pm – 3:00pm PDT
    Test Vision Session 2: AI Test Initiatives and Innovation
    Session Moderator (TV): Trent Weaver – Teradyne
    Test
  • 2:00pm – 4:00pm PDT
    Smart Mobility: Software Defined Vehicle
    Smart Mobility
  • 2:00pm – 4:05pm PDT
    Latest Trends in Sensorization
    MEMS & Sensors
  • 2:00pm – 4:50pm PDT
    Smart Manufacturing Session 4: Accelerating Sustainability with Smart Manufacturing
    Smart Manufacturing
  • 2:00pm – 5:15pm PDT
    Heterogeneous Integration: Roadmapping the Future
    Heterogeneous Integration
  • 2:20pm – 3:20pm PDT
    Beyond Tier Mapping - Creating a Robust and Resilient Supply Chain Risk
    Panel Moderator (CEO Summit): Bettina Weiss – SEMI
    Panelist: Kannan Perumal – Applied Materials
    Panelist: Roger Kao – GlobalFoundries
    Panelist: Boris Metodiev – TechInsights
    Panelist: Helmer Fredrich – Electronics, a business of Merck KGaA, Darmstadt, Germany
    Panelist: Ben Fullmer – Intel
    Market Trends
  • 3:00pm – 3:30pm PDT
    FLEX Student Poster Networking Break
    FLEX
  • 3:05pm – 5:05pm PDT
    PFAS: Regulatory Threats, Supply Chain Challenges, Research Opportunities and Industry Collaboration
    EHS & Sustainability
  • 3:10pm – 5:00pm PDT
    Test Vision Poster Session and Reception
    Session Moderator (TV): Stuart Pearce – AEM
    TestNetworking
  • 3:20pm – 4:20pm PDT
    Bulls and Bears
    Panel Moderator: Lucia Greenblatt – Mitsubishi UFJ Financial Group (MUFG )
    Panelist: C.J. Muse – Cantor Fitzgerald
    Panelist: Mark Lipacis – Evercore
    Panelist: Joseph Moore, Jr. – Morgan Stanley
    Panelist: Lori A. Keith – Parnassus Investments
    Market Trends
  • 3:30pm – 5:00pm PDT
    FLEX Session 10: Materials & Processing Breakthroughs
    Session Chair (FLEX): Mark D. Poliks – Binghamton University, State University of New York
    FLEX
  • 3:30pm – 5:00pm PDT
    FLEX Session 11: Manufacturing Process Innovations II
    Session Chair (FLEX): Robert F. Praino, Jr. – Chasm Advanced Materials Inc
    FLEX
  • 4:00pm – 5:30pm PDT
    Smart Mobility Reception
  • 4:30pm – 6:00pm PDT
    Workforce Development Reception
  • 4:50pm – 6:00pm PDT
    Smart Manufacturing Poster Session & Networking Reception
    Smart ManufacturingNetworking
  • 5:00pm – 5:30pm PDT
    FLEXI Awards + Student Poster Awards
    Session Moderator (FLEX): Gity Samadi – SEMI
    Speaker (FLEX): Tiffany Tu – SEMI
    FLEX
  • 5:30pm – 6:30pm PDT
    FLEX Panel Discussion: Enabling the Future of Electronics
    Panel Moderator (FLEX): Tim Janes – Association for Roll-to-Roll Converters (formerly AIMCAL)
    Panelist (FLEX): Christopher Tabor – Air Force Research Laboratory
    Panelist (FLEX): C.P. Hung – ASE Group
    Panelist (FLEX): Robert F. Praino, Jr. – Chasm Advanced Materials Inc
    Panelist (FLEX): Masaaki Sugimoto – Elephantech Inc
    Panelist (FLEX): Madhu Stemmermann – SunRay Scientific Inc.
    Panelist (FLEX): Rafael D. Tudela, IV – Tapecon
    FLEX
  • 5:30pm – 6:30pm PDT
    Heterogeneous Integration Forum Reception
  • 5:30pm – 7:30pm PDT
    MSIG Reception