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Monday, Jul 8th
5:30pm – 7:00pm PDT
SEMICON West and FLEX Conference Welcome Reception
Location: Moscone South, Upper Lobby
NetworkingFLEX
Sponsors
Tuesday, Jul 9th
8:30am – 3:30pm PDT
CEO Summit: Investing in America's Manufacturing Future
Location: CEO Summit Stage, North Hall, Room 24
CEO Summit/KeynoteFLEX
Tuesday, Jul 9th
8:30am – 8:35am PDT
SEMICON West Welcome Remarks
Location: CEO Summit Stage, North Hall, Room 24
Keynote Moderator: Joe Stockunas – SEMI
CEO Summit/KeynoteFLEX
Tuesday, Jul 9th
8:35am – 8:45am PDT
SEMICON West Opening Remarks
Location: CEO Summit Stage, North Hall, Room 24
Keynote Speaker: Ajit Manocha – SEMI
CEO Summit/KeynoteFLEX
Tuesday, Jul 9th
8:45am – 8:50am PDT
Special Announcement
Special Guest: The Honorable Eric J. Holcomb
Keynote Moderator: Joe Stockunas – SEMI
CEO Summit/KeynoteFLEX
Tuesday, Jul 9th
8:50am – 9:15am PDT
Keynote: CHIPS Act Update
Location: CEO Summit Stage, North Hall, Room 24
Keynote Speaker (CEO Summit): Laurie E. Locascio – National Institute of Standards and Technology, U.S. Department of Commerce
CEO Summit/KeynoteFLEX
Tuesday, Jul 9th
9:15am – 9:40am PDT
From Rust Belt to Tech Hub: How Upstate New York Came to Lead America’s Semiconductor Comeback
Location: CEO Summit Stage, North Hall, Room 24
Keynote Speaker (CEO Summit): Kevin Younis – Empire State Development (ESD)
CEO Summit/KeynoteFLEX
Tuesday, Jul 9th
9:40am – 10:05am PDT
Arizona: Home of America’s Semiconductor Resurgence
Location: CEO Summit Stage, North Hall, Room 24
Keynote Speaker (CEO Summit): Sandra Watson – Arizona Commerce Authority.
CEO Summit/KeynoteFLEX
Tuesday, Jul 9th
10:05am – 10:30am PDT
Seizing Global Opportunities
Location: CEO Summit Stage, North Hall, Room 24
Keynote Speaker (CEO Summit): Keyvan Esfarjani – Intel Corporation
CEO Summit/KeynoteFLEX
Tuesday, Jul 9th
10:30am – 11:00am PDT
Fireside Chat: Accelerating the US Semiconductor Ecosystem
Location: CEO Summit Stage, North Hall, Room 24
Fireside Chat Speaker (CEO Summit): Tim Archer – Lam Research
Fireside Chat Speaker (CEO Summit): Thomas Caulfield – GlobalFoundries
Fireside Chat Speaker (CEO Summit): Mario A. Morales – IDC
CEO Summit/KeynoteFLEX
Tuesday, Jul 9th
11:00am – 11:25am PDT
Collaborative Innovation to Accelerate Energy Efficient Compute for A.I.
Location: CEO Summit Stage, North Hall, Room 24
Keynote Speaker (CEO Summit): Prabu Raja – Applied Materials
CEO Summit/KeynoteFLEX
Tuesday, Jul 9th
1:00pm – 1:25pm PDT
Preparing for the Semiconductor Materials Supply Chain of 2030
Location: CEO Summit Stage, North Hall, Room 24
Keynote Speaker (CEO Summit): Bertrand Loy – Entegris
CEO Summit/KeynoteFLEX
Tuesday, Jul 9th
1:25pm – 1:50pm PDT
Staying Ahead of What’s Next, A Strategic Expansion
Location: CEO Summit Stage, North Hall, Room 24
Keynote Speaker (CEO Summit): Hichem M'Saad, PhD – ASM
CEO Summit/KeynoteFLEX
Tuesday, Jul 9th
1:50pm – 2:15pm PDT
Investing in collaboration: Stronger together in the resurgence of the semiconductor industry in the US
Location: CEO Summit Stage, North Hall, Room 24
Keynote Speaker (CEO Summit): Kai Beckmann – EMD Electronics
CEO Summit/KeynoteFLEX
Tuesday, Jul 9th
2:15pm – 2:25pm PDT
20 under 30 Recognition
Location: CEO Summit Stage, North Hall, Room 24
CEO Summit/KeynoteFLEX
Tuesday, Jul 9th
2:25pm – 2:50pm PDT
Fireside Chat: Securing Critical Supply Chains for the 21st Century
Location: CEO Summit Stage, North Hall, Room 24
Fireside Chat Speaker (CEO Summit): Jose W. Fernandez – U.S. Department of State
Fireside Chat Speaker (CEO Summit): Joe Stockunas – SEMI
CEO Summit/KeynoteFLEX
Tuesday, Jul 9th
2:50pm – 3:15pm PDT
Let's Get to Work: CHIPS for America's Workforce Accomplishments and Plans
Location: CEO Summit Stage, North Hall, Room 24
Keynote Speaker (CEO Summit): Scott Jensen – U.S. Department of Commerce
CEO Summit/KeynoteFLEX
Tuesday, Jul 9th
3:15pm – 3:30pm PDT
Closing remarks: Investing in America's Manufacturing Future
Location: CEO Summit Stage, North Hall, Room 24
Keynote Speaker: Joe Stockunas – SEMI
CEO Summit/KeynoteFLEX
Tuesday, Jul 9th
10:30am – 12:30pm PDT
FLEX Keynotes
Location: Moscone South, Level 3, Room 301
Session Chair (FLEX): Melissa Grupen-Shemansky – SEMI
FLEX
Tuesday, Jul 9th
10:30am – 12:30pm PDT
FLEXTalks
Location: FLEXTalks Theater, Moscone South, Exhibition Level, Hall C
Session Moderator (FLEX): Lin Tso – SEMI Americas
FLEX
Tuesday, Jul 9th
10:30am – 10:45am PDT
Welcome to the FLEX Conference
Location: Moscone South, Level 3, Room 301
Speaker (FLEX): Melissa Grupen-Shemansky – SEMI
FLEX
Tuesday, Jul 9th
10:35am – 10:50am PDT
Printed Electronics as Sustainable Solutions
Location: FLEXTalks Theater, Moscone South, Exhibition Level, Hall C
Speaker (FLEXTalks): Masaaki Sugimoto – Elephantech Inc
FLEX
Tuesday, Jul 9th
10:45am – 11:30am PDT
Responsible Human/AI Collaboration
Location: Moscone South, Level 3, Room 301
Keynote Speaker (FLEX): Lama Nachman – Intel Corporation
FLEX
Tuesday, Jul 9th
10:50am – 11:05am PDT
Aerosol Printing with Industrial Stability
Location: FLEXTalks Theater, Moscone South, Exhibition Level, Hall C
Speaker (FLEXTalks): Dov Phillips – IDS
FLEX
Tuesday, Jul 9th
11:05am – 11:20am PDT
Desktop PCB Fabrication - Additively Manufactured
Location: FLEXTalks Theater, Moscone South, Exhibition Level, Hall C
Speaker (FLEXTalks): Afnan Islam – BotFactory Inc.
FLEX
Tuesday, Jul 9th
11:20am – 11:35am PDT
High-Energy, PFA-free, Lithium Cobalt Oxide Batteries Charged with RaiCore Electrodes
Location: FLEXTalks Theater, Moscone South, Exhibition Level, Hall C
Speaker (FLEXTalks): Rajan Kumar – Ateios Systems
FLEX
Tuesday, Jul 9th
11:30am – 12:15pm PDT
A Vision for Next Generation Intelligent Electric Systems
Location: Moscone South, Level 3, Room 301
Keynote Speaker (FLEX): Ercan M. Dede – Toyota Research Institute of North America
FLEX
Tuesday, Jul 9th
11:35am – 11:50am PDT
Printed Circuitry and Bonding of Functional Components to TPU for a Wearable Biosensor Device
Location: FLEXTalks Theater, Moscone South, Exhibition Level, Hall C
Speaker (FLEXTalks): John M. Yundt – SunRay Scientific Inc.
FLEX
Tuesday, Jul 9th
11:50am – 12:05pm PDT
New Trends in Reliability for Additive Electronics
Location: FLEXTalks Theater, Moscone South, Exhibition Level, Hall C
Speaker (FLEXTalks): Eisuke Tsuyuzaki – Bayflex Solutions
FLEX
Tuesday, Jul 9th
12:05pm – 12:20pm PDT
Capacitor and Inductor Embedded/Integrated Package Solution(iPaS) for Next Generation High Performance Computing (HPC) Applications
Location: FLEXTalks Theater, Moscone South, Exhibition Level, Hall C
Speaker (FLEXTalks): Marty Yano – Murata
FLEX
Tuesday, Jul 9th
12:15pm – 12:30pm PDT
FLEX Keynotes Closing Remarks
Location: Moscone South, Level 3, Room 301
Speaker (FLEX): Melissa Grupen-Shemansky – SEMI
FLEX
Tuesday, Jul 9th
12:20pm – 12:30pm PDT
FLEXTalks Wrap up Morning Session
Location: FLEXTalks Theater, Moscone South, Exhibition Level, Hall C
Speaker (FLEXTalks): Lin Tso – SEMI Americas
FLEX
Tuesday, Jul 9th
12:30pm – 1:30pm PDT
FLEX Gathering at the Taste of San Francisco
Location: Moscone South, Expo Floor
FLEX
Tuesday, Jul 9th
1:30pm – 3:00pm PDT
FLEX Session 2: Testing and Reliability
Location: Moscone South, Level 3, Room 301
Session Chair (FLEX): Christopher Tabor – Air Force Research Laboratory
FLEX
Tuesday, Jul 9th
1:30pm – 3:00pm PDT
FLEX Session 3: New Frontiers in FHE Applications I
Location: Moscone South, Level 3, Room 302
Session Chair (FLEX): Rafael D. Tudela, IV – Tapecon
FLEX
Tuesday, Jul 9th
1:30pm – 2:00pm PDT
Dynamic Harsh Environmental FHE Reliability Testing (DHERT)
Location: Moscone South, Level 3, Room 301
Speaker (FLEX): Douglas R. Hackler, Sr. – American Semiconductor
FLEX
Tuesday, Jul 9th
1:30pm – 2:00pm PDT
Multi-layer Flexible Displays using Electroluminescent Ink
Location: Moscone South, Level 3, Room 302
Speaker (FLEX): Katarina Ilić – Voltera
FLEX
Tuesday, Jul 9th
2:00pm – 2:30pm PDT
Flexible Electrohydraulic Actuators for the Future of Motion
Location: Moscone South, Level 3, Room 302
Speaker (FLEX): Eric Acome – Artimus Robotics Inc
FLEX
Tuesday, Jul 9th
2:00pm – 2:30pm PDT
Investigation of Possible Accelerated Temperature Cycling Test Methods
Location: Moscone South, Level 3, Room 301
Speaker (FLEX): Daniel M. Kwak – Henkel Corporation
FLEX
Tuesday, Jul 9th
2:30pm – 3:00pm PDT
Customized mechanical testing for characterizing fatigue performance of flexible electronics
Location: Moscone South, Level 3, Room 301
Speaker (FLEX): Diana D. Chin – Exponent
Speaker (FLEX): Shuyang Fang – Exponent
FLEX
Tuesday, Jul 9th
2:30pm – 3:00pm PDT
Transparent Heater Films-Development and Design
Location: Moscone South, Level 3, Room 302
Speaker (FLEX): Johann Rindisbacher – Chasm Advanced Materials
FLEX
Tuesday, Jul 9th
2:00pm – 4:00pm PDT
FLEXTalks
Location: FLEXTalks Theater, Moscone South, Exhibition Level, Hall C
Session Moderator (FLEX): Lin Tso – SEMI Americas
FLEX
Tuesday, Jul 9th
2:00pm – 2:05pm PDT
Welcome to FLEXTalks
Location: FLEXTalks Theater, Moscone South, Exhibition Level, Hall C
Speaker (FLEXTalks): Lin Tso – SEMI Americas
FLEX
Tuesday, Jul 9th
2:05pm – 2:20pm PDT
Flex, Rigidflex, Design, Manufacturing and In-house Assembly
Location: FLEXTalks Theater, Moscone South, Exhibition Level, Hall C
Speaker (FLEXTalks): Mike Morando – PFC Flexible Circuits
FLEX
Tuesday, Jul 9th
2:20pm – 2:35pm PDT
BioMEMS and FLEX Electronics: Medical FLEX Applications and a Foundry to Serve Them
Location: FLEXTalks Theater, Moscone South, Exhibition Level, Hall C
Speaker (FLEXTalks): Mark Hettick – Precision
FLEX
Tuesday, Jul 9th
2:35pm – 2:50pm PDT
Capacitor and Inductor Embedded/Integrated Package Solution(iPaS) for Next Generation High Performance Computing (HPC) Applications
Location: FLEXTalks Theater, Moscone South, Exhibition Level, Hall C
Speaker (FLEXTalks): Marty Yano – Murata
FLEX
Tuesday, Jul 9th
2:50pm – 3:05pm PDT
Direct patterning of micron-scale by Super Inkjet technology
Location: FLEXTalks Theater, Moscone South, Exhibition Level, Hall C
Speaker (FLEXTalks): Kotaro Shimizu – SIJTechnology, Inc.
FLEX
Tuesday, Jul 9th
3:05pm – 3:20pm PDT
Complimentary PE Equipment From a Single Source
Location: FLEXTalks Theater, Moscone South, Exhibition Level, Hall C
Speaker (FLEXTalks): Douglas A. Schardt – Komori America Corp
FLEX
Tuesday, Jul 9th
3:20pm – 3:35pm PDT
Next Step for Semiconductor Advanced Package (Panel-level package for RF, Power and Chiplet integration)
Location: FLEXTalks Theater, Moscone South, Exhibition Level, Hall C
Speaker (FLEXTalks): Yoshiaki Aizawa – AOI Electronics Co. Ltd.
FLEX
Tuesday, Jul 9th
3:35pm – 3:50pm PDT
Flexible Electrohydraulic Actuators for the Future of Motion
Location: FLEXTalks Theater, Moscone South, Exhibition Level, Hall C
Speaker (FLEXTalks): Eric Acome – Artimus Robotics Inc
FLEX
Tuesday, Jul 9th
3:50pm – 4:00pm PDT
FLEXTalks Closing Remarks
Location: FLEXTalks Theater, Moscone South, Exhibition Level, Hall C
Speaker (FLEXTalks): Lin Tso – SEMI Americas
FLEX
Tuesday, Jul 9th
3:00pm – 3:30pm PDT
FLEX Student Poster Networking Break
Location: Moscone South, Level 3, Room 303
FLEX
Tuesday, Jul 9th
3:30pm – 4:30pm PDT
FLEX Session 4: Manufacturing Process Innovations I
Location: Moscone South, Level 3, Room 301
Session Chair (FLEX): Eisuke Tsuyuzaki – Bayflex Solutions
FLEX
Tuesday, Jul 9th
3:30pm – 4:30pm PDT
FLEX Session 5: Material Breakthroughs
Location: Moscone South, Level 3, Room 302
Session Chair (FLEX): Samira Bagheri – EMD Electronics
FLEX
Tuesday, Jul 9th
3:30pm – 4:00pm PDT
Increased Functionality for IoT through Direct Die Attach of Wire-bondable Chips on Flexible Hybrid Electronics (FHE)
Location: Moscone South, Level 3, Room 301
Speaker (FLEX): John M. Yundt – SunRay Scientific Inc.
FLEX
Tuesday, Jul 9th
3:30pm – 4:00pm PDT
Printed opto-electronic devices based on nanomaterial semiconductor inks
Location: Moscone South, Level 3, Room 302
Speaker (FLEX): Chad Husko – Iris Light Technologies, Inc.
FLEX
Tuesday, Jul 9th
4:00pm – 4:30pm PDT
Advanced Hybrid Additive Manufacturing Software & Processes for Volumetric FHEs
Location: Moscone South, Level 3, Room 301
Speaker (FLEX): Gilbert T. Carranza – Kraetonics, LLC
FLEX
Tuesday, Jul 9th
4:00pm – 4:30pm PDT
Sustainable Additive Process-Performance Interactions with Biodegradable and Water-Based Materials
Location: Moscone South, Level 3, Room 302
Speaker (FLEX): Pradeep Lall – Auburn University
FLEX
Tuesday, Jul 9th
4:30pm – 5:30pm PDT
FLEX Funding Opportunities
Location: Moscone South, Level 3, Room 301
FLEX
Tuesday, Jul 9th
4:30pm – 4:35pm PDT
Welcome Remarks
Location: Moscone South, Level 3, Room 301
Speaker (FLEX): Melissa Grupen-Shemansky – SEMI
FLEX
Tuesday, Jul 9th
4:55pm – 5:10pm PDT
Overview of the NextFlex Manufacturing Institute Programs
Location: Moscone South, Level 3, Room 301
Speaker (FLEX): Scott M. Miller – NextFlex
FLEX
Tuesday, Jul 9th
5:10pm – 5:15pm PDT
Other Funding Opportunities
Location: Moscone South, Level 3, Room 301
Speaker (FLEX): Melissa Grupen-Shemansky – SEMI
FLEX
Tuesday, Jul 9th
5:15pm – 5:30pm PDT
Networking and Connecting to Projects
Location: Moscone South, Level 3, Room 301
FLEX
Tuesday, Jul 9th
5:30pm – 7:00pm PDT
FLEX Reception
Location: Moscone South, Level 3, Room 303
FLEXNetworking
Wednesday, Jul 10th
8:00am – 3:20pm PDT
CEO Summit: Seizing the Global Opportunities and Challenges Ahead
Location: CEO Summit Stage, North Hall, Room 24
CEO Summit/KeynoteFLEX
Wednesday, Jul 10th
8:00am – 8:10am PDT
SEMICON West Welcome Remarks
Location: CEO Summit Stage, North Hall, Room 24
Keynote Speaker (CEO Summit): Joe Stockunas – SEMI
CEO Summit/KeynoteFLEX
Wednesday, Jul 10th
8:10am – 8:20am PDT
Semiconductor Industry and Climate Change
Location: CEO Summit Stage, North Hall, Room 24
Keynote Speaker (CEO Summit): The Honorable Al Gore – Generation Investment Management
CEO Summit/KeynoteFLEX
Wednesday, Jul 10th
8:20am – 8:45am PDT
Sustainability Keynote: Presentation title TBD - Nasdaq
Location: CEO Summit Stage, North Hall, Room 24
Keynote Speaker (CEO Summit): Jeff Thomas – Nasdaq
CEO Summit/KeynoteFLEX
Wednesday, Jul 10th
8:45am – 9:35am PDT
Chief Sustainability Officer (CSO) Panel Discussion – Bracing for the Evolving Global Risk for the Semiconductor Ecosystem
Location: CEO Summit Stage, North Hall, Room 24
Panel Moderator (CEO Summit): Mousumi Bhat, PhD – SEMI
Panelist (CEO Summit): Frank Sanders – Intel
Panelist (CEO Summit): Angela Baker – Qualcomm, Inc
Panelist (CEO Summit): John Powers – Schneider Electric
CEO Summit/KeynoteFLEX
Wednesday, Jul 10th
9:35am – 10:00am PDT
AI for AI: Empowering Semiconductor Materials Development In The New Era Of Artificial Intelligence
Location: CEO Summit Stage, North Hall, Room 24
Keynote Speaker (CEO Summit): John Langan – EMD Electronics
CEO Summit/KeynoteFLEX
Wednesday, Jul 10th
10:00am – 10:25am PDT
Superconducting Quantum Computing: Building on Decades of Semiconductor Innovation for Transformative Computational Power
Location: CEO Summit Stage, North Hall, Room 24
Keynote Speaker (CEO Summit): Subodh Kulkarni – Rigetti
CEO Summit/KeynoteFLEX
Wednesday, Jul 10th
10:25am – 10:35am PDT
Presentation of the SEMI Foundation Excellence in Achievement Award
Location: CEO Summit Stage, North Hall, Room 24
Keynote Speaker (CEO Summit): Shari Liss – SEMI Foundation
CEO Summit/KeynoteFLEX
Wednesday, Jul 10th
10:35am – 11:05am PDT
Fireside Chat: Advocating for Real Change: Why Inclusion and Belonging Need to be Everyone’s Concern
Location: CEO Summit Stage, North Hall, Room 24
Fireside Chat Speaker (CEO Summit): Sandra Mahadwar – KLA Corporation
Fireside Chat Speaker (CEO Summit): Shari Liss – SEMI Foundation
CEO Summit/KeynoteFLEX
Wednesday, Jul 10th
11:05am – 11:30am PDT
Workforce Keynote: Shaping the Future: Intel’s Academic Collaborations
Location: CEO Summit Stage, North Hall, Room 24
Keynote Speaker (CEO Summit): Gabriela Cruz Thompson – Intel Corporation
CEO Summit/KeynoteFLEX
Wednesday, Jul 10th
11:30am – 11:55am PDT
Workforce Keynote: Empowering the Next Generation: Navigating the Semiconductor Renaissance - Micron Technology
Location: CEO Summit Stage, North Hall, Room 24
Keynote Speaker (CEO Summit): Scott Gatzemeier – Micron Technology
CEO Summit/KeynoteFLEX
Wednesday, Jul 10th
11:55am – 12:20pm PDT
Workforce Keynote: Creating a Talent Pipeline for Semiconductor Growth – Veteran Focused - TEL
Location: CEO Summit Stage, North Hall, Room 24
Keynote Speaker (CEO Summit): Larry Smith – Texas Semiconductor Innovation Consortium
CEO Summit/KeynoteFLEX
Wednesday, Jul 10th
1:30pm – 1:55pm PDT
The Changing Dynamic in Global Supply Chains
Location: CEO Summit Stage, North Hall, Room 24
Keynote Speaker (CEO Summit): Mike Wilson – DSV
CEO Summit/KeynoteFLEX
Wednesday, Jul 10th
1:55pm – 2:20pm PDT
Key Considerations of Building Competitive Wafer Fabs
Location: CEO Summit Stage, North Hall, Room 24
Keynote Speaker (CEO Summit): Herbert Blaschitz – Exyte
CEO Summit/KeynoteFLEX
Wednesday, Jul 10th
10:30am – 12:30pm PDT
FLEX Keynotes
Location: Moscone South, Level 3, Room 301
Session Chair (FLEX): Gity Samadi – SEMI
Session Chair (FLEX): Robert F. Praino, Jr. – Chasm Advanced Materials Inc
FLEX
Wednesday, Jul 10th
10:30am – 10:45am PDT
Keynote Welcome Remarks
Location: Moscone South, Level 3, Room 301
Speaker (FLEX): Gity Samadi – SEMI
FLEX
Wednesday, Jul 10th
10:45am – 11:30am PDT
Microgravity: A New Frontier for Next-Generation Semiconductor Materials & Electronic Fabrication
Location: Moscone South, Level 3, Room 301
Keynote Speaker (FLEX): Chyree Batton – Axiom Space
FLEX
Wednesday, Jul 10th
11:30am – 12:15pm PDT
Advanced Packaging for Sustainable Additive Manufacturing Innovations
Location: Moscone South, Level 3, Room 301
Keynote Speaker (FLEX): C.P. Hung – ASE Group
FLEX
Wednesday, Jul 10th
12:15pm – 12:30pm PDT
FLEX Keynotes Closing Remarks
Location: Moscone South, Level 3, Room 301
Speaker (FLEX): Robert F. Praino, Jr. – Chasm Advanced Materials Inc
FLEX
Wednesday, Jul 10th
12:30pm – 1:30pm PDT
FLEX Gathering at the Taste of San Francisco
Location: Moscone South, Expo Floor
FLEX
Wednesday, Jul 10th
1:30pm – 3:00pm PDT
FLEX Session 8: New Frontiers in FHE Applications II
Location: Moscone South, Level 3, Room 301
Session Chair (FLEX): Carolyn Ellinger – Eastman Kodak Company
FLEX
Wednesday, Jul 10th
1:30pm – 3:00pm PDT
FLEX Session 9: Developments in Printing & Other Additive Manufacturing
Location: Moscone South, Level 3, Room 302
Session Chair (FLEX): Scott M. Miller – NextFlex
FLEX
Wednesday, Jul 10th
1:30pm – 2:00pm PDT
Bending the Future: The Expanding Horizons of Flexible Hybrid Electronics
Location: Moscone South, Level 3, Room 301
Speaker (FLEX): Rafael D. Tudela, IV – Tapecon
FLEX
Wednesday, Jul 10th
1:30pm – 2:00pm PDT
Printing Solid Core Wires Via Molten Metal Droplet Jetting
Location: Moscone South, Level 3, Room 302
Speaker (FLEX): Denis Cormier – Rochester Institute of Technology
FLEX
Wednesday, Jul 10th
2:00pm – 2:30pm PDT
Galvanic Skin Response through Additively Printed In-Mold Electronics in Automotive Applications
Location: Moscone South, Level 3, Room 301
Speaker (FLEX): Pradeep Lall – Auburn University
FLEX
Wednesday, Jul 10th
2:00pm – 2:30pm PDT
New Printhead Generation: breaking technical barriers of inkjet technology in terms of resolution and ink viscosity
Speaker (FLEX): Patrick Galliker – Scrona
FLEX
Wednesday, Jul 10th
2:30pm – 3:00pm PDT
I2C Performance Modeling and Analysis Over Fabric Bus
Location: Moscone South, Level 3, Room 301
Speaker (FLEX): Jose Ignacio Rodriguez-Labra – NextFlex
FLEX
Wednesday, Jul 10th
2:30pm – 3:00pm PDT
Mass production with AI-accelerated high-precision inkjet printing: NeuralJet™ Technology
Location: Moscone South, Level 3, Room 302
Speaker (FLEX): Masaaki Sugimoto – Elephantech Inc
FLEX
Wednesday, Jul 10th
3:00pm – 3:30pm PDT
FLEX Student Poster Networking Break
Location: Moscone South, Level 3, Room 303
FLEX
Wednesday, Jul 10th
3:30pm – 5:00pm PDT
FLEX Session 10: Materials & Processing Breakthroughs
Location: Moscone South, Level 3, Room 301
Session Chair (FLEX): Mark D. Poliks – Binghamton University, State University of New York
FLEX
Wednesday, Jul 10th
3:30pm – 5:00pm PDT
FLEX Session 11: Manufacturing Process Innovations II
Location: Moscone South, Level 3, Room 302
Session Chair (FLEX): Robert F. Praino, Jr. – Chasm Advanced Materials Inc
FLEX
Wednesday, Jul 10th
3:30pm – 4:00pm PDT
Minimum Size of Printed Micro Bump using Gravure Offset
Location: Moscone South, Level 3, Room 302
Speaker (FLEX): Douglas A. Schardt – Komori America Corp
FLEX
Wednesday, Jul 10th
3:30pm – 4:00pm PDT
Print Treatments to Enable Unique Substrates for Printed Electronics
Location: Moscone South, Level 3, Room 301
Speaker (FLEX): Jim Honan, Sr. – Eastman Kodak Company
FLEX
Wednesday, Jul 10th
4:00pm – 4:30pm PDT
Development of Stretchable Liquid Metal Data Cables with ELMNT
Location: Moscone South, Level 3, Room 301
Speaker (FLEX): Jack T. Ly – UES, Blue Hallo
FLEX
Wednesday, Jul 10th
4:00pm – 4:30pm PDT
Innovative Full-Automatic Roll-to-Roll Laser SMT Technology for Ultra-thin Flexible Film PCB
Location: Moscone South, Level 3, Room 302
Speaker (FLEX): Nam Seong Kim – Laserssel Co., Ltd
FLEX
Wednesday, Jul 10th
4:30pm – 5:00pm PDT
Advances in Volume Manufacturing for Emerging Applications of Amperometric Gas Sensors
Location: Moscone South, Level 3, Room 302
Speaker (FLEX): Bennett Meulendyk – Interlink Electronics
FLEX
Wednesday, Jul 10th
4:30pm – 5:00pm PDT
Conformal Film Encapsulation of Sensitive and Flexible Hybrid Electronic Devices
Location: Moscone South, Level 3, Room 301
Speaker (FLEX): Zander F. Brandt – NextFlex
FLEX
Wednesday, Jul 10th
5:00pm – 5:30pm PDT
FLEXI Awards + Student Poster Awards
Location: Moscone South, Level 3, Room 301
Session Moderator (FLEX): Gity Samadi – SEMI
Speaker (FLEX): Tiffany Tu – SEMI
FLEX
Wednesday, Jul 10th
5:30pm – 6:30pm PDT
FLEX Panel Discussion: Enabling the Future of Electronics
Location: Moscone South, Level 3, Room 301
Panel Moderator (FLEX): Tim Janes – Association for Roll-to-Roll Converters (formerly AIMCAL)
Panelist (FLEX): Christopher Tabor – Air Force Research Laboratory
Panelist (FLEX): C.P. Hung – ASE Group
Panelist (FLEX): Robert F. Praino, Jr. – Chasm Advanced Materials Inc
Panelist (FLEX): Masaaki Sugimoto – Elephantech Inc
Panelist (FLEX): Madhu Stemmermann – SunRay Scientific Inc.
Panelist (FLEX): Rafael D. Tudela, IV – Tapecon
FLEX
Thursday, Jul 11th
10:00am – 10:30am PDT
FLEX Exhibits Show Floor Tour
Location: Smart MedTech Theater, Moscone South, Exhibition Level, Hall C
Session Moderator (FLEX): Rafael D. Tudela, IV – Tapecon
FLEX
Thursday, Jul 11th
10:30am – 12:40pm PDT
Smart MedTech Innovations: Emerging MedTech Monitoring Technologies
Location: Smart MedTech Theater, Moscone South, Exhibition Level, Hall C
Smart MedTechFLEX
Thursday, Jul 11th
12:40pm – 1:30pm PDT
FLEX Gathering at the Taste of San Francisco
Location: Moscone South, Expo Floor
FLEX
Thursday, Jul 11th
1:30pm – 3:40pm PDT
Smart MedTech Innovations: MedTech Commercialization
Location: Smart MedTech Theater, Moscone South, Exhibition Level, Hall C
Smart MedTechFLEX
Friday, Jul 12th
9:00am – 11:00am PDT
FLEX Industry Tours
Location: Offsite
FLEX
Friday, Jul 12th
9:00am – 11:00am PDT
DuPont Silicon Valley Technology Center (SVTC)
Location: Offsite
FLEX
Friday, Jul 12th
9:00am – 11:00am PDT
Promex Industries in the Heart of Silicon Valley
Location: Offsite
FLEX
FLEX: Student Poster Session
Location: Moscone South, Level 3, Room 303
FLEX
3D Printed FHE Microcalorimetric Array
Location: Moscone South, Level 3, Room 303
Student Poster Presenter (FLEX): Mehdi Yaghoubi Arzefouni – Northeastern University
FLEX
Aerosol-Printed Stretchable PDMS-CNT Materials for Advanced Wearable Strain Sensors
Location: Moscone South, Level 3, Room 303
Student Poster Presenter (FLEX): K.R. Ajay Narayan – IIT Bombay
FLEX
Demonstration of an active, flexible connector for signaling in large area computational systems
Location: Moscone South, Level 3, Room 303
Student Poster Presenter (FLEX): Randall Irwin – UCLA Center for Heterogeneous Integration and Performance Scaling
FLEX
Enhanced Gas Sensitivity in Organic Field-Effect Transistors Comprising High-Surface Area Expanded Poly(tetrafluoroethylene) Membrane Gate Dielectrics
Location: Moscone South, Level 3, Room 303
Student Poster Presenter (FLEX): Christopher Riley Bond – Johns Hopkins University
FLEX
Flexible Hybrid Electronics (FHE) Metrology Enabled by GHz Ultrasound
Location: Moscone South, Level 3, Room 303
Student Poster Presenter (FLEX): Yilmaz Arin Manav – Northeastern University
FLEX
Fully Automatic Multi-Material Additive Manufacturing of Rigid-Flex Electronics
Location: Moscone South, Level 3, Room 303
Student Poster Presenter (FLEX): Vidyacharan Gopaluni Venkata – University of Colorado - Boulder
FLEX
In-Situ Surface Treatment and Self-Sintering of Conductive Traces with Improved Adhesion using PJP
Location: Moscone South, Level 3, Room 303
Student Poster Presenter (FLEX): Lakshmi Prakasan – Oregon State University
FLEX
Integration of Quantum Dots with A HI High Resolution, Flexible MicroLED Display using FlexTrateTM
Location: Moscone South, Level 3, Room 303
Student Poster Presenter (FLEX): Henry Sun – UCLA
FLEX
Multi-Stage Process Diagnosis Networks in Semiconductor Manufacturing
Location: Moscone South, Level 3, Room 303
Student Poster Presenter (FLEX): Jongwon Choi – Korea University
FLEX
Silicon-Based Microevaporator for Direct-Write Vapor Deposition
Location: Moscone South, Level 3, Room 303
Student Poster Presenter (FLEX): Xella Doi – University of Chicago
FLEX
Submicron Resolution Printed Interconnect for On-Demand Hybrid Device Fabrication
Location: Moscone South, Level 3, Room 303
Student Poster Presenter (FLEX): Kaifan Yue – University of Michigan
FLEX
Towards Sustainable Development of Printed Electronics for Low-cost Single-use Medical Wearables
Location: Moscone South, Level 3, Room 303
Student Poster Presenter (FLEX): Udara S. Somarathna – Binghamton University
FLEX
Wiring of Transistor Paper for On-Demand Flexible Microelectronics
Location: Moscone South, Level 3, Room 303
Student Poster Presenter (FLEX): Rebecca K. Banner – Georgia Institute of Technology
FLEX